Issued Patents All Time
Showing 26–50 of 113 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8885849 | Component having a micromechanical microphone structure, and method for operating such a microphone component | Alberto Arias-Drake, Thomas Buck, Jochen Zoellin, Juan Ramos-Martos, Antonio Ragel-Morales +2 more | 2014-11-11 |
| 8861765 | Microphone component and method for operating same | Thomas Buck | 2014-10-14 |
| 8671746 | Piezoelectric generator | Thorsten Pannek, Ralf Reichenbach, Marian Keck | 2014-03-18 |
| 8637945 | Component having a micromechanical microphone structure, and method for its production | Frank Reichenbach, Thomas Buck, Jochen Zoellin, Ulrike Scholz, Kathrin van Teeffelen +1 more | 2014-01-28 |
| 8629011 | Epitaxial silicon CMOS-MEMS microphones and method for manufacturing | Brett Mathew Diamond, Andrew J. Doller, Michael J. Daley, Phillip Sean Stetson, John M. Muza | 2014-01-14 |
| 8607450 | Method for manufacturing a micropump and micropump | Julia Cassemeyer, Michael Stumber, Ralf Reichenbach | 2013-12-17 |
| 8506530 | Microneedles to be placed in the skin for the transdermal application of pharmaceuticals | Michael Stumber, Dick Scholten, Christian Maeurer | 2013-08-13 |
| 8501516 | Method for producing micromechanical patterns having a relief-like sidewall outline shape or an adjustable angle of inclination | Tino Fuchs, Christina Leinenbach | 2013-08-06 |
| 8492850 | Method for producing a silicon substrate having modified surface properties and a silicon substrate of said type | Gerhard Lammel, Hubert Benzel, Matthias Illing, Silvia Kronmueller, Paul Farber +4 more | 2013-07-23 |
| 8466042 | Method for manufacturing separated micromechanical components situated on a silicon substrate and components manufactured therefrom | Kathrin van Teeffelen, Christina Leinenbach | 2013-06-18 |
| 8382940 | Device and method for producing chlorine trifluoride and system for etching semiconductor substrates using this device | — | 2013-02-26 |
| 8377315 | Method for manufacturing porous microstructures, porous microstructures manufactured according to this method, and the use thereof | Dick Scholten, Tjalf Pirk, Michael Stumber, Ralf Reichenbach, Ando Feyh | 2013-02-19 |
| 8354033 | Method for producing porous microneedles and their use | Dick Scholten, Julia Cassemeyer, Michael Stumber, Ando Feyh, Christian Maeurer | 2013-01-15 |
| 8332092 | Method for detecting the state of a tire | Thorsten Pannek | 2012-12-11 |
| 8329555 | Method for producing a capping wafer for a sensor | Frank Reichenbach, Silvia Kronmueller, Andreas Scheurle | 2012-12-11 |
| 8182707 | Method for etching a layer on a substrate | Silvia Kronmueller, Tino Fuchs, Christina Leinenbach | 2012-05-22 |
| 8164174 | Microstructure component | — | 2012-04-24 |
| 8154174 | Bending transducer device for generating electrical energy from deformations and circuit module | Thorsten Pannek, Ralf Reichenbach, Marian Keck | 2012-04-10 |
| 8148234 | Method for manufacturing a semiconductor structure, and a corresponding Semiconductor Structure | Gerhard Lammel, Hubert Benzel, Matthias Illing, Silvia Kronmueller, Paul Farber +4 more | 2012-04-03 |
| 8040023 | Bending transducer for generating electrical energy from mechanical deformations | Thorsten Pannek, Ralf Reichenbach, Marian Keck | 2011-10-18 |
| 7898046 | Microelectromechanical systems encapsulation process | Markus Ulm, Brian Stark, Matthias Metz, Tino Fuchs, Silvia Kronmueller | 2011-03-01 |
| 7872333 | Layer system comprising a silicon layer and a passivation layer, method for production a passivation layer on a silicon layer and the use of said system and method | Lutz Mueller, Winfried Bernhard | 2011-01-18 |
| 7855150 | Plasma system and method for anisotropically etching structures into a substrate | Andrea Urban | 2010-12-21 |
| 7834409 | Micromechanical component and corresponding method for its manufacture | Frank Reichenbach, Silvia Kronmueller, Christoph Schelling, Tino Fuchs, Christina Leinenbach | 2010-11-16 |
| 7811941 | Device and method for etching a substrate using an inductively coupled plasma | Volker Becker, Andrea Schilp | 2010-10-12 |