JL

Jin-Yuan Lee

ME Megica: 132 patents #2 of 32Top 7%
TSMC: 74 patents #411 of 12,232Top 4%
IC Icometrue Company: 54 patents #1 of 5Top 20%
QU Qualcomm: 10 patents #2,039 of 12,104Top 20%
MA Megit Acquisition: 6 patents #2 of 12Top 20%
Disney: 1 patents #3,944 of 6,686Top 60%
Overall (All Time): #1,539 of 4,157,543Top 1%
281
Patents All Time

Issued Patents All Time

Showing 201–225 of 281 patents

Patent #TitleCo-InventorsDate
6635936 SRAM layout for relaxing mechanical stress in shallow trench isolation technology Shou-Gwo Wuu, Dun-Nian Yaung, Jeng-Han Lee 2003-10-21
6613606 Structure of high performance combo chip and processing method 2003-09-02
6605528 Post passivation metal scheme for high-performance integrated circuit devices Mou-Shiung Lin, Ming-Ta Lei, Ching-Cheng Huang 2003-08-12
6600186 Process technology architecture of embedded DRAM Mong-Song Liang 2003-07-29
6522009 Apparatus to electroless plate a metal layer while eliminating the photo electric effect 2003-02-18
6495912 Structure of ceramic package with integrated passive devices Ching-Cheng Huang, Mou-Shiung Lin 2002-12-17
6495442 Post passivation interconnection schemes on top of the IC chips Mou-Shiung Lin 2002-12-17
6476460 Stacked gate MOS structure for multiple voltage power supply applications Mong-Song Liang, Choe-San Yoo 2002-11-05
6433665 High efficiency thin film inductor Kuo-Ching Huang, Tse-Liang Ying 2002-08-13
6399997 High performance system-on-chip using post passivation process and glass substrates Mou-Shiung Lin 2002-06-04
6387801 Method and an apparatus to electroless plate a metal layer while eliminating the photoelectric effect 2002-05-14
6373369 High efficiency thin film inductor Kuo-Ching Huang, Tse-Liang Ying 2002-04-16
6346729 Pseudo silicon on insulator MOSFET device Mong-Song Liang, Chue-San Yoo 2002-02-12
6327682 Wafer burn-in design for DRAM and FeRAM devices Pien Chien 2001-12-04
6278352 High efficiency thin film inductor Kuo-Ching Huang, Tse-Liang Ying 2001-08-21
6268281 Method to form self-aligned contacts with polysilicon plugs Cheng-Yeh Shih, Chung-Long Chang 2001-07-31
6265301 Method of forming metal interconnect structures and metal via structures using photolithographic and electroplating or electro-less plating procedures Chen-Jong Wang 2001-07-24
6239458 Polysilicon-via structure for four transistor, triple polysilicon layer SRAM cell including two polysilicon layer load resistor Jhon Jhy Liaw 2001-05-29
6214698 Shallow trench isolation methods employing gap filling doped silicon oxide dielectric layer Jhon Jhy Liaw, Kuei-Ying Lee, Chu-Yun Fu, Kong-Beng Thei 2001-04-10
6180530 Self-aligned contact structure Jhon Jhy Liaw 2001-01-30
6174754 Methods for formation of silicon-on-insulator (SOI) and source/drain-on-insulator(SDOI) transistors Mong-Song Liang, Boon-Khim Liew 2001-01-16
6172411 Self-aligned contact structures using high selectivity etching Li-Chih Chao, Jhon Jhy Liaw, Yuan-Chang Huang 2001-01-09
6136633 Trench-free buried contact for locos isolation Dun-Nian Yaung, Shou-Gwo Wuu 2000-10-24
6136638 Process technology architecture of embedded DRAM Mong-Song Liang 2000-10-24
6117722 SRAM layout for relaxing mechanical stress in shallow trench isolation technology and method of manufacture thereof Shou-Gwo Wuu, Dun-Nian Yaung, Jeng-Han Lee 2000-09-12