Issued Patents All Time
Showing 151–175 of 281 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7466007 | Post passivation interconnection schemes on top of IC chip | Mou-Shiung Lin | 2008-12-16 |
| 7462938 | Post passivation interconnection schemes on top of IC chip | Mou-Shiung Lin | 2008-12-09 |
| 7459791 | Post passivation interconnection schemes on top of IC chip | Mou-Shiung Lin | 2008-12-02 |
| 7449752 | Post passivation interconnection schemes on top of the IC chips | Mou-Shiung Lin | 2008-11-11 |
| 7446035 | Post passivation interconnection schemes on top of IC chips | Mou-Shiung Lin | 2008-11-04 |
| 7446031 | Post passivation interconnection schemes on top of IC chips | Mou-Shiung Lin | 2008-11-04 |
| 7443034 | Post passivation interconnection schemes on top of the IC chips | Mou-Shiung Lin | 2008-10-28 |
| 7443033 | Post passivation interconnection schemes on top of the IC chips | Mou-Shiung Lin | 2008-10-28 |
| 7439626 | Post passivation interconnection schemes on top of IC chip | Mou-Shiung Lin | 2008-10-21 |
| 7439627 | Post passivation interconnection schemes on top of the IC chips | Mou-Shiung Lin | 2008-10-21 |
| 7427560 | Top layers of metal for high performance IC's | Mou-Shiung Lin | 2008-09-23 |
| 7419900 | Post passivation interconnection schemes on top of the IC chips | Mou-Shiung Lin | 2008-09-02 |
| 7420276 | Post passivation structure for semiconductor chip or wafer | Mou-Shiung Lin | 2008-09-02 |
| 7413929 | Integrated chip package structure using organic substrate and method of manufacturing the same | Mou-Shiung Lin, Ching-Cheng Huang | 2008-08-19 |
| 7405149 | Post passivation method for semiconductor chip or wafer | Mou-Shiung Lin | 2008-07-29 |
| 7405150 | Post passivation interconnection schemes on top of the IC chips | Mou-Shiung Lin | 2008-07-29 |
| 7397117 | Chip package with die and substrate | Mou-Shiung Lin, Ching-Cheng Huang | 2008-07-08 |
| 7382052 | Post passivation interconnection schemes on top of IC chip | Mou-Shiung Lin | 2008-06-03 |
| 7355288 | Low fabrication cost, high performance, high reliability chip scale package | Ming-Ta Lei, Ching-Cheng Huang, Chuen-Jye Lin | 2008-04-08 |
| 7351650 | Post passivation interconnection schemes on top of the IC chips | Mou-Shiung Lin | 2008-04-01 |
| 7345365 | Electronic component with die and passive device | Mou-Shiung Lin, Ching-Cheng Huang | 2008-03-18 |
| 7338890 | Low fabrication cost, high performance, high reliability chip scale package | Ming-Ta Lei, Ching-Cheng Huang, Chuen-Jye Lin | 2008-03-04 |
| 7319377 | Method for making high-performance RF integrated circuits | Mou-Shiung Lin | 2008-01-15 |
| 7309920 | Chip structure and process for forming the same | Mou-Shiung Lin, Ching-Cheng Huang | 2007-12-18 |
| 7297614 | Method for fabricating circuitry component | Mou-Shiung Lin, Ching-Cheng Huang | 2007-11-20 |