TY

Tse-Liang Ying

TSMC: 23 patents #1,475 of 12,232Top 15%
EP Epistar: 2 patents #394 of 732Top 55%
ET Epitech Technology: 1 patents #6 of 15Top 40%
📍 Baoshan, TW: #94 of 3,661 inventorsTop 3%
Overall (All Time): #155,852 of 4,157,543Top 4%
26
Patents All Time

Issued Patents All Time

Showing 1–25 of 26 patents

Patent #TitleCo-InventorsDate
RE43426 Fabrication method of transparent electrode on visible light-emitting diode Shi-Ming Chen 2012-05-29
7541205 Fabrication method of transparent electrode on visible light-emitting diode Shi-Ming Chen 2009-06-02
7192794 Fabrication method of transparent electrode on visible light-emitting diode Shi-Ming Chen 2007-03-20
6436762 Method for improving bit line to capacitor electrical failures on DRAM circuits using a wet etch-back to improve the bit-line-to-capacitor overlay margins Kuo-Chyuan Tzeng, Min-Hsiung Chiang, Hsiao-Hui Tseng, Chung-Wei Chang 2002-08-20
6433665 High efficiency thin film inductor Kuo-Ching Huang, Jin-Yuan Lee 2002-08-13
6373369 High efficiency thin film inductor Kuo-Ching Huang, Jin-Yuan Lee 2002-04-16
6306767 Self-aligned etching method for forming high areal density patterned microelectronic structures Kuo-Chyuan Tzeng, Wen-Chuan Chiang, Ming-Hsiang Chiang 2001-10-23
6307213 Method for making a fuse structure for improved repaired yields on semiconductor memory devices Kuo-Ching Huang, Cheng-Yeh Shih, Yu-Hua Lee, Cheng-Ming Wu 2001-10-23
6287939 Method for fabricating a shallow trench isolation which is not susceptible to buried contact trench formation Kuo-Ching Huang, Wen-Chuan Chiang 2001-09-11
6278352 High efficiency thin film inductor Kuo-Ching Huang, Jin-Yuan Lee 2001-08-21
6214715 Method for fabricating a self aligned contact which eliminates the key hole problem using a two step spacer deposition Kuo-Ching Huang, Wen-Chuan Chiang 2001-04-10
6207492 Common gate and salicide word line process for low cost embedded DRAM devices Kuo-Chyuan Tzeng, Chen-Jong Wang, Kevin Chiang 2001-03-27
6194234 Method to evaluate hemisperical grain (HSG) polysilicon surface Kuo-Ching Huang, Wen-Chuan Chiang, Yu-Hua Lee 2001-02-27
6187659 Node process integration technology to improve data retention for logic based embedded dram Wen-Chuan Chiang, Cheng-Ming Wu, Yu-Hua Lee 2001-02-13
6174802 Method for fabricating a self aligned contact which eliminates the key hole problem using a two step contact deposition Kuo-Ching Huang, Wen-Chuan Chiang, Min-Hsiung Chiang 2001-01-16
6168984 Reduction of the aspect ratio of deep contact holes for embedded DRAM devices Chue-San Yoo, Ming-Hsiung Chiang, Wen-Chuan Chiang, Cheng-Ming Wu 2001-01-02
6162686 Method for forming a fuse in integrated circuit application Kuo-Ching Huang, Yu-Hua Lee, Ming Li 2000-12-19
6121073 Method for making a fuse structure for improved repaired yields on semiconductor memory devices Kuo-Ching Huang, Cheng-Yeh Shih, Yu-Hua Lee, Cheng-Ming Wu 2000-09-19
6093619 Method to form trench-free buried contact in process with STI technology Kuo-Ching Huang, Chia-Shiung Tsai 2000-07-25
6080637 Shallow trench isolation technology to eliminate a kink effect Kuo-Ching Huang, Wen-Chuan Chiang, Cheng-Yeh Shih 2000-06-27
6037222 Method for fabricating a dual-gate dielectric module for memory embedded logic using salicide technology and polycide technology Kuo-Ching Huang, Chen-Jong Wang, Jenn Ming Huang 2000-03-14
5946596 Method for preventing polycide line deformation by polycide hardening 1999-08-31
5922515 Approaches to integrate the deep contact module Wen-Chuan Chiang 1999-07-13
5885865 Method for making low-topography buried capacitor by a two stage etching process and device made Mong-Song Liang, Julie Huang, Chen-Jong Wang 1999-03-23
5811331 Formation of a stacked cylindrical capacitor module in the DRAM technology Mong-Song Liang 1998-09-22