MC

Min-Hsiung Chiang

TSMC: 30 patents #1,141 of 12,232Top 10%
📍 New Taipei, TW: #302 of 10,472 inventorsTop 3%
Overall (All Time): #113,386 of 4,157,543Top 3%
32
Patents All Time

Issued Patents All Time

Showing 1–25 of 32 patents

Patent #TitleCo-InventorsDate
9899263 Method of forming layout design Tung-Heng Hsieh, Chung-Te Lin, Sheng-Hsiung Wang, Hui-Zhong Zhuang, Ting-Wei Chiang +1 more 2018-02-20
9691721 Jog design in integrated circuits Tsung-Lin Wu, Tung-Heng Hsieh, Jiun-Ming Kuo, Che-Yuan Hsu 2017-06-27
9570584 Semiconductor structure and manufacturing method thereof Chih-Hsiung Lin, Chia-Der Chang, Pin-Cheng Hsu, Shu-Wei Chung, Hao-Wen Hsu 2017-02-14
9355912 Jog design in integrated circuits Tsung-Lin Wu, Tung-Heng Hsieh, Jiun-Ming Kuo, Che-Yuan Hsu 2016-05-31
9336348 Method of forming layout design Tung-Heng Hsieh, Chung-Te Lin, Sheng-Hsiung Wang, Hui-Zhong Zhuang, Ting-Wei Chiang +1 more 2016-05-10
8901627 Jog design in integrated circuits Tsung-Lin Wu, Tung-Heng Hsieh, Jiun-Ming Kuo, Che-Yuan Che 2014-12-02
7622347 Self-aligned metal electrode to eliminate native oxide effect for metal insulator semiconductor (MIS) capacitor Chih-Ta Wu, Tsung-Hsun Huang 2009-11-24
7332394 Method to reduce a capacitor depletion phenomena 2008-02-19
7238566 Method of forming one-transistor memory cell and structure formed thereby 2007-07-03
7208369 Dual poly layer and method of manufacture Chih-Yang Pai, Chen-Jong Wang, Shou-Gwo Wuu 2007-04-24
7180116 Self-aligned metal electrode to eliminate native oxide effect for metal insulator semiconductor (MIS) capacitor Chih-Ta Wu, Tsung-Hsun Huang 2007-02-20
6849387 Method for integrating copper process and MIM capacitor for embedded DRAM Chi-Hsin Lo 2005-02-01
6818495 Method for forming high purity silicon oxide field oxide isolation region Jin-Yuan Lee, Jenn Ming Huang 2004-11-16
6808980 Method of process simplification and eliminating topography concerns for the creation of advanced 1T-RAM devices Chung-Yi Chen, Hsien-Yuan Chang 2004-10-26
6797557 Methods and systems for forming embedded DRAM for an MIM capacitor 2004-09-28
6656786 MIM process for logic-based embedded RAM having front end manufacturing operation Hsiao-Hui Tseng, Hsien-Yuan Chang, Tazy-Schiuan Yang 2003-12-02
6656785 MIM process for logic-based embedded RAM Hsiao-Hui Tseng, Hsien-Yuan Chang 2003-12-02
6600228 Keyhole at the top metal level prefilled with photoresist to prevent passivation damage even for a severe top metal rule Yu-Hua Lee, Jenn Ming Huang 2003-07-29
6569732 Integrated process sequence allowing elimination of polysilicon residue and silicon damage during the fabrication of a buried stack capacitor structure in a SRAM cell Chung-Wei Chang, Kuo-Chyuan Tzeng 2003-05-27
6495425 Memory cell structure integrating self aligned contact structure with salicide gate electrode structure 2002-12-17
6436762 Method for improving bit line to capacitor electrical failures on DRAM circuits using a wet etch-back to improve the bit-line-to-capacitor overlay margins Kuo-Chyuan Tzeng, Tse-Liang Ying, Hsiao-Hui Tseng, Chung-Wei Chang 2002-08-20
6383863 Approach to integrate salicide gate for embedded DRAM devices Hsiao-Hui Tseng, Hsien-Yuan Chang, Chung-Wei Chang, Kuo-Chyuan Tzeng 2002-05-07
6365325 Aperture width reduction method for forming a patterned photoresist layer Huan-Just Lin, James C. Wu, Cheng-Tung Lin 2002-04-02
6294456 Method of prefilling of keyhole at the top metal level with photoresist to prevent passivation damage even for a severe top metal rule Yu-Hua Lee, Jenn Ming Huang 2001-09-25
6274426 Self-aligned contact process for a crown shaped dynamic random access memory capacitor structure Yu-Hua Lee, James Wu 2001-08-14