| 5378306 |
Composite for providing a rigid-flexible circuit board construction and method for fabrication thereof |
Michael J. Cibulsky, Konstantinos I. Papathomas, David W. Wang, Patrick Robert Zippetelli |
1995-01-03 |
| 5319244 |
Triazine thin film adhesives |
Konstantinos I. Papathomas, David W. Wang, Ashit A. Mehta |
1994-06-07 |
| 5288542 |
Composite for providing a rigid-flexible circuit board construction and method for fabrication thereof |
Michael J. Cibulsky, Konstantinos I. Papathomas, David W. Wang, Patrick Robert Zippetelli |
1994-02-22 |
| 5250347 |
Mechanically enhanced, high impact strength triazine resins, and method of preparing same |
Ashit A. Mehta, Tyan M. Niu, Lee P. Springer, Lee P. Wilding |
1993-10-05 |
| 5206074 |
Adhesives on polymide films and methods of preparing them |
Charles R. Davis, Ashit A. Mehta, Konstantinos I. Papathomas, Lee P. Springer, David W. Wang |
1993-04-27 |
| 5153986 |
Method for fabricating metal core layers for a multi-layer circuit board |
John M. Brauer, Frederick R. Christie, William H. Lawrence, Ashit A. Mehta, Jonathan D. Reid |
1992-10-13 |
| 5126192 |
Flame retardant, low dielectric constant microsphere filled laminate |
Leroy N. Chellis, Robert M. Japp, William J. Rudik, David W. Wang |
1992-06-30 |
| 5103293 |
Electronic circuit packages with tear resistant organic cores |
Edward J. Bonafino, Richard W. Carpenter, Peter Lueck, David W. Wang |
1992-04-07 |
| 5015719 |
Aromatic dicyanate/aromatic diepoxy compositions, cured products and methods |
Kostas Papathomas, David W. Wang |
1991-05-14 |
| 4873123 |
Flexible electrical connection and method of making same |
Michael J. Canestaro |
1989-10-10 |
| 4745215 |
Fluorine containing dicyanate resins |
Robert J. Cox, David W. Wang |
1988-05-17 |
| 4728751 |
Flexible electrical connection and method of making same |
Michael J. Canestaro |
1988-03-01 |
| 4697923 |
Method for visual inspection of multilayer printed circuit boards |
Gerald W. Jones, W. Robert Pratt |
1987-10-06 |
| 4659425 |
Continuous process for the manufacture of printed circuit boards |
Eugene A. Eggers |
1987-04-21 |
