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Package-on-package assembly with wire bond vias |
Ellis Chau, Reynaldo Co, Roseann Alatorre, Philip Damberg, Se Young Yang |
2025-01-28 |
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Package-on-package assembly with wire bonds to encapsulation surface |
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2023-11-28 |
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Package-on-package assembly with wire bond vias |
Ellis Chau, Reynaldo Co, Roseann Alatorre, Philip Damberg, Se Young Yang |
2023-08-22 |
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Package-on-package assembly with wire bonds to encapsulation surface |
Hiroaki Sato, Teck-Gyu Kang, Belgacem Haba, Philip R. Osborn, Ellis Chau +6 more |
2022-08-23 |
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Package-on-package assembly with wire bond vias |
Ellis Chau, Reynaldo Co, Roseann Alatorre, Philip Damberg, Se Young Yang |
2021-11-30 |
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Package-on-package assembly with wire bonds to encapsulation surface |
Hiroaki Sato, Teck-Gyu Kang, Belgacem Haba, Philip R. Osborn, Ellis Chau +6 more |
2020-11-10 |
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Package-on-package assembly with wire bond vias |
Ellis Chau, Reynaldo Co, Roseann Alatorre, Philip Damberg, Se Young Yang |
2020-08-25 |
| 10593643 |
Package-on-package assembly with wire bonds to encapsulation surface |
Hiroaki Sato, Teck-Gyu Kang, Belgacem Haba, Philip R. Osborn, Ellis Chau +6 more |
2020-03-17 |
| 10163808 |
Module with embedded side shield structures and method of fabricating the same |
Nitesh Kumbhat, Deog Soon Choi |
2018-12-25 |
| 10062661 |
Package-on-package assembly with wire bonds to encapsulation surface |
Hiroaki Sato, Teck-Gyu Kang, Belgacem Haba, Philip R. Osborn, Ellis Chau +6 more |
2018-08-28 |
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Method of attaching components to printed cirucuit board with reduced accumulated tolerances |
Li Sun, Ashish Alawani, Lea-Teng Lee |
2018-01-09 |
| 9761558 |
Package-on-package assembly with wire bond vias |
Ellis Chau, Reynaldo Co, Roseann Alatorre, Philip Damberg, Se Young Yang |
2017-09-12 |
| 9716075 |
Semiconductor chip assembly and method for making same |
Teck-Gyu Kang, Hiroaki Sato, Kiyoaki Hashimoto, Yoshikuni Nakadaira, Norihito Masuda +3 more |
2017-07-25 |
| 9691731 |
Package-on-package assembly with wire bonds to encapsulation surface |
Hiroaki Sato, Teck-Gyu Kang, Belgacem Haba, Philip R. Osborn, Ellis Chau +6 more |
2017-06-27 |
| 9349672 |
Microelectronic package |
Ilyas Mohammed, Belgacem Haba, Sean Moran, Ellis Chau, Christopher Wade |
2016-05-24 |
| 9252122 |
Package-on-package assembly with wire bond vias |
Ellis Chau, Reynaldo Co, Roseann Alatorre, Philip Damberg, Se Young Yang |
2016-02-02 |
| 9224717 |
Package-on-package assembly with wire bonds to encapsulation surface |
Hiroaki Sato, Teck-Gyu Kang, Belgacem Haba, Philip R. Osborn, Ellis Chau +6 more |
2015-12-29 |
| 9137903 |
Semiconductor chip assembly and method for making same |
Teck-Gyu Kang, Hiroaki Sato, Kiyoaki Hashimoto, Yoshikuni Nakadaira, Norihito Masuda +3 more |
2015-09-15 |
| 9105483 |
Package-on-package assembly with wire bond vias |
Ellis Chau, Reynaldo Co, Roseann Alatorre, Philip Damberg, Se Young Yang |
2015-08-11 |
| 9093435 |
Package-on-package assembly with wire bonds to encapsulation surface |
Hiroaki Sato, Teck-Gyu Kang, Belgacem Haba, Philip R. Osborn, Ellis Chau +6 more |
2015-07-28 |
| 9041227 |
Package-on-package assembly with wire bond vias |
Ellis Chau, Reynaldo Co, Roseann Alatorre, Philip Damberg, Se Young Yang |
2015-05-26 |
| 8836136 |
Package-on-package assembly with wire bond vias |
Ellis Chau, Reynaldo Co, Roseann Alatorre, Philip Damberg, Se Young Yang +1 more |
2014-09-16 |
| 8618659 |
Package-on-package assembly with wire bonds to encapsulation surface |
Hiroaki Sato, Teck-Gyu Kang, Belgacem Haba, Philip R. Osborn, Ellis Chau +6 more |
2013-12-31 |
| 8404520 |
Package-on-package assembly with wire bond vias |
Ellis Chau, Reynaldo Co, Roseann Alatorre, Philip Damberg, Se Young Yang |
2013-03-26 |
| 8299626 |
Microelectronic package |
Ilyas Mohammed, Belgacem Haba, Sean Moran, Ellis Chau, Christopher Wade |
2012-10-30 |