| 6597058 |
Method of forming defect-free ceramic structures using thermally depolymerizable surface layer |
Govindarajan Natarajan, Richard F. Indyk, Krishna G. Sachdev |
2003-07-22 |
| 6423174 |
Apparatus and insertless method for forming cavity substrates using coated membrane |
Jon A. Casey, Govindarajan Natarajan, Robert W. Pasco |
2002-07-23 |
| 6391669 |
Embedded structures to provide electrical testing for via to via and interface layer alignment as well as for conductive interface electrical integrity in multilayer devices |
Benjamin V. Fasano, Hai P. Longworth, Anthony L. Plachy, Robert N. Wiggin |
2002-05-21 |
| 6281692 |
Interposer for maintaining temporary contact between a substrate and a test bed |
Paul F. Bodenweber, Ralph R. Comulada, Jr., Mukta S. Farooq, Charles J. Hendricks, Philo B. Hodge +3 more |
2001-08-28 |
| 6261927 |
Method of forming defect-free ceramic structures using thermally depolymerizable surface layer |
Govindarajan Natarajan, Richard F. Indyk, Krishna G. Sachdev |
2001-07-17 |
| 6255827 |
Search routine for 2-point electrical tester |
Mukta S. Farooq, Kathleen M. Wiley |
2001-07-03 |
| 5788808 |
Apparatus for forming cavity substrates using compressive pads |
Govindarajan Natarajan, Robert W. Pasco, Charles H. Perry |
1998-08-04 |
| 5759320 |
Method of forming cavity substrates using compressive pads |
Govindarajan Natarajan, Robert W. Pasco, Charles H. Perry |
1998-06-02 |
| 5643818 |
Removal of residues from metallic insert used in manufacture of multi-layer ceramic substrate with cavity for microelectronic chip |
Krishna G. Sachdev, Thomas E. Lombardi |
1997-07-01 |
