Issued Patents All Time
Showing 1–25 of 28 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11084717 | Through-substrate conductor support | John Charles Ehmke | 2021-08-10 |
| 10693020 | Semiconductor device package and method for use thereof | Brent Hans Larson | 2020-06-23 |
| 10427932 | Hermetically sealed MEMS device and its fabrication | John Charles Ehmke | 2019-10-01 |
| 10392246 | Through-substrate conductor support | John Charles Ehmke | 2019-08-27 |
| 9890036 | Hermetically sealed MEMS device and its fabrication | John Charles Ehmke | 2018-02-13 |
| 9567213 | Hermetically-sealed MEMS device and its fabrication | John Charles Ehmke | 2017-02-14 |
| 9228860 | Sensor and method of providing a sensor | Nirmal Sharma, Leonardo T. Magpantay, Raymond W. Engle, William P. Taylor, Kirsten Doogue +1 more | 2016-01-05 |
| 9227836 | Hermetic plastic molded MEMS device package and method of fabrication | — | 2016-01-05 |
| 9140898 | Hermetically sealed MEMS device and its fabrication | John Charles Ehmke, Toby Linder, Lance W. Barron | 2015-09-22 |
| 9102511 | Hermetic plastic molded MEMS device package and method of fabrication | — | 2015-08-11 |
| 8785250 | Methods and apparatus for flip-chip-on-lead semiconductor package | Nirmal Sharma | 2014-07-22 |
| 8691607 | Hermetically sealed MEMS device and method of fabrication | — | 2014-04-08 |
| 8486755 | Magnetic field sensors and methods for fabricating the magnetic field sensors | Nirmal Sharma, Raymond W. Engel, Jay Gagnon, John Sauber, William P. Taylor +1 more | 2013-07-16 |
| 8461677 | Magnetic field sensors and methods for fabricating the magnetic field sensors | Nirmal Sharma, Raymond W. Engel, Jay Gagnon, John Sauber, William P. Taylor +1 more | 2013-06-11 |
| 8207598 | Semiconductor package heat spreader | Il Kwon Shim, Seng Guan Chow, Sheila Marie L. Alvarez | 2012-06-26 |
| 7863730 | Array-molded package heat spreader and fabrication method therefor | Il Kwon Shim, Kambhampati Ramakrishna, Diane Sahakian, Seng Guan Chow, Dario S. Filoteo, Jr. | 2011-01-04 |
| 7786593 | Integrated circuit die with pedestal | Il Kwon Shim, Seng Guan Chow | 2010-08-31 |
| 7575956 | Fabrication method for semiconductor package heat spreaders | Il Kwon Shim, Seng Guan Chow, Sheila Marie L. Alvarez | 2009-08-18 |
| 7381593 | Method and apparatus for stacked die packaging | Harvey Kong | 2008-06-03 |
| 7361531 | Methods and apparatus for Flip-Chip-On-Lead semiconductor package | Nirmal Sharma | 2008-04-22 |
| 7327025 | Heat spreader for thermally enhanced semiconductor package | Il Kwon Shim, Sheila Marie L. Alvarez | 2008-02-05 |
| 7242101 | Integrated circuit die with pedestal | Il Kwon Shim, Seng Guan Chow | 2007-07-10 |
| 7153725 | Strip-fabricated flip chip in package and flip chip in system heat spreader assemblies and fabrication methods therefor | Tie Wang, Il Kwon Shim, Sheila Marie L. Alvarez | 2006-12-26 |
| 6960493 | Semiconductor device package | Hermes T. Apale, Il Kwon Shim | 2005-11-01 |
| 6875634 | Heat spreader anchoring and grounding method and thermally enhanced PBGA package using the same | Il Kwon Shim, Hermes T. Apale, Weddie Aquien, Dario S. Filoteo, Jr., Leo A. Merilo | 2005-04-05 |