| 11513001 |
Light sensor module including a polarizing element to block display light |
Feng-Jung Hsu |
2022-11-29 |
| 7955100 |
Connector and electronic device having the same |
Ming-Hung Chung, Shu-Fen Huang, Yu-Chen Lee |
2011-06-07 |
| 7518241 |
Wafer structure with a multi-layer barrier in an UBM layer network device with power supply |
Li-Cheng Tai, Jui-I Yu, Jiunn Chen, Chueh-An Hsieh, Shyh-Ing Wu +2 more |
2009-04-14 |
| 7375020 |
Method of forming bumps |
Min-Lung Huang, Shih-Chang Lee, Jen-Kuang Fang, Yung-I Yeh |
2008-05-20 |
| 7221052 |
Chip scale package with micro antenna and method for manufacturing the same |
Min-Lung Huang |
2007-05-22 |
| 7064428 |
Wafer-level package structure |
Ho-Ming Tong, Chun-Chi Lee, Jen-Kuang Fang, Min-Lung Huang, Jau-Shoung Chen +5 more |
2006-06-20 |
| 6967153 |
Bump fabrication process |
Ho-Ming Tong, Chun-Chi Lee, Jen-Kuang Fang, Min-Lung Huang, Jau-Shoung Chen +5 more |
2005-11-22 |
| 6927964 |
Structure for preventing burnt fuse pad from further electrical connection |
Ho-Ming Tong, Chun-Chi Lee, Jen-Kuang Fang, Min-Lung Huang, Jau-Shoung Chen +5 more |
2005-08-09 |
| 6916732 |
Method of forming bumps |
Min-Lung Huang, Shih-Chang Lee, Jen-Kuang Fang, Yung-I Yeh |
2005-07-12 |
| 6877653 |
Method of modifying tin to lead ratio in tin-lead bump |
Ho-Ming Tong, Chun-Chi Lee, Jen-Kuang Fang, Min-Lung Huang, Jau-Shoung Chen +5 more |
2005-04-12 |
| 6846719 |
Process for fabricating wafer bumps |
Ho-Ming Tong, Chun-Chi Lee, Jen-Kuang Fang, Min-Lung Huang, Jau-Shoung Chen +5 more |
2005-01-25 |
| 6756256 |
Method for preventing burnt fuse pad from further electrical connection |
Ho-Ming Tong, Chun-Chi Lee, Jen-Kuang Fang, Min-Lung Huang, Jau-Shoung Chen +5 more |
2004-06-29 |
| 6732912 |
Solder ball attaching process |
Ho-Ming Tong, Chun-Chi Lee, Jen-Kuang Fang, Min-Lung Huang, Jau-Shoung Chen +5 more |
2004-05-11 |
| 6720244 |
Bump fabrication method |
Ho-Ming Tong, Chun-Chi Lee, Jen-Kuang Fang, Min-Lung Huang, Jau-Shoung Chen +5 more |
2004-04-13 |
| 6713320 |
Bumping process |
Ho-Ming Tong, Chun-Chi Lee, Jen-Kuang Fang, Min-Lung Huang, Jau-Shoung Chen +5 more |
2004-03-30 |
| 6692581 |
Solder paste for fabricating bump |
Ho-Ming Tong, Chun-Chi Lee, Jen-Kuang Fang, Ching-Fu Horng, Shih-Kuang Chen +5 more |
2004-02-17 |
| 6664128 |
Bump fabrication process |
Ho-Ming Tong, Chun-Chi Lee, Jen-Kuang Fang, Min-Lung Huang, Jau-Shoung Chen +4 more |
2003-12-16 |
| 6617237 |
Lead-free bump fabrication process |
Ho-Ming Tong, Chun-Chi Lee, Jen-Kuang Fang, Min-Lung Huang, Jau-Shoung Chen +5 more |
2003-09-09 |
| 6374833 |
Method of in situ reactive gas plasma treatment |
Tien-Min Yuan, Shih-Chi Lai, Yen-Chung Feng |
2002-04-23 |