Issued Patents All Time
Showing 25 most recent of 29 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8695956 | Compression coil spring and manufacturing device and manufacturing method for coil spring | Hideki Okada, Kenji Yamamotoya | 2014-04-15 |
| 7963510 | Compression coil spring device having a discrete support | Masahiro Umezawa, Tomotake Kato, Masanao Ueda | 2011-06-21 |
| 7193320 | Semiconductor device having a heat spreader exposed from a seal resin | Sumikazu Hosoyamada, Yoshitsugu Kato, Mitsuo Abe, Kazuto Tsuji, Masaharu Minamizawa +3 more | 2007-03-20 |
| 6696754 | Semiconductor module including a plurality of semiconductor devices detachably | Mitsutaka Sato, Tetsuya Fujisawa, Shigeyuki Maruyama, Junichi Kasai, Toshimi Kawahara +5 more | 2004-02-24 |
| 6627479 | Semiconductor device having a plurality of semiconductor elements interconnected by a redistribution layer | Yoshitaka Aiba, Mitsutaka Sato | 2003-09-30 |
| 6472744 | Semiconductor module including a plurality of semiconductor devices detachably | Mitsutaka Sato, Tetsuya Fujisawa, Shigeyuki Maruyama, Junichi Kasai, Toshimi Kawahara +5 more | 2002-10-29 |
| 6462424 | Semiconductor device, method of producing semiconductor device and semiconductor device mounting structure | Masaaki Seki, Katsuhiro Hayashida, Mitsutaka Sato | 2002-10-08 |
| 6460835 | Wheel suspension system and spring therefor | Hirotake Kato, Iwao Shigeoka, Takahiro Nakamura, Toshiyuki Kamakura, Masaya Komazaki | 2002-10-08 |
| 6433418 | Apparatus for a vertically accumulable semiconductor device with external leads secured by a positioning mechanism | Tetsuya Fujisawa, Mitsutaka Sato, Seiichi Orimo, Kazuhiko Mitobe, Masaaki Seki +4 more | 2002-08-13 |
| 6348728 | Semiconductor device having a plurality of semiconductor elements interconnected by a redistribution layer | Yoshitaka Aiba, Mitsutaka Sato | 2002-02-19 |
| 6347037 | Semiconductor device and method of forming the same | Makoto Iijima, Tetsushi Wakabayashi, Masaharu Minamizawa, Masashi Takenaka, Taturou Yamashita +3 more | 2002-02-12 |
| 6333564 | Surface mount type semiconductor device and method of producing the same having an interposing layer electrically connecting the semiconductor chip with protrusion electrodes | Yoshitsugu Katoh, Mitsutaka Sato, Hiroshi Inoue, Seiichi Orimo, Akira Okada +6 more | 2001-12-25 |
| 6307259 | Plastic package for semiconductor device | Kenji Asada, Mitsuo Abe | 2001-10-23 |
| 6288444 | Semiconductor device and method of producing the same | Mitsuo Abe, Yoshihiro Kubota, Yoshitsugu Katoh, Michio Hayakawa, Ryuji Nomoto +3 more | 2001-09-11 |
| 6235997 | LSI package with equal length transmission Lines | Kenji Asada, Yoshihiko Ikemoto | 2001-05-22 |
| 6184133 | Method of forming an assembly board with insulator filled through holes | Makoto Iijima, Tetsushi Wakabayashi, Masaharu Minamizawa, Masashi Takenaka, Taturou Yamashita +1 more | 2001-02-06 |
| 6165819 | Semiconductor device, method of producing semiconductor device and semiconductor device mounting structure | Masaaki Seki, Katsuhiro Hayashida, Mitsutaka Sato | 2000-12-26 |
| 6094356 | Semiconductor device and semiconductor device module | Tetsuya Fujisawa, Mitsutaka Sato, Kazuhiko Mitobe, Katsuhiro Hayashida, Masaaki Seki +1 more | 2000-07-25 |
| 6088233 | Semiconductor device and assembly board having through-holes filled with filling core | Makoto Iijima, Tetsushi Wakabayashi, Masaharu Minamizawa, Masashi Takenaka, Taturou Yamashita +1 more | 2000-07-11 |
| 5978222 | Semiconductor device and assembly board having through-holes filled with filling core | Makoto Iijima, Tetsushi Wakabayashi, Masaharu Minamizawa, Masashi Takenaka, Taturou Yamashita +1 more | 1999-11-02 |
| 5923540 | Semiconductor unit having semiconductor device and multilayer substrate, in which grounding conductors surround conductors used for signal and power | Kenji Asada, Masaru Nukiwa | 1999-07-13 |
| 5804468 | Process for manufacturing a packaged semiconductor having a divided leadframe stage | Kazuto Tsuji, Yoshiyuki Yoneda, Hideharu Sakoda, Michio Sono, Ichiro Yamaguchi +5 more | 1998-09-08 |
| 5729435 | Semiconductor device and assembly board having through-holes filled with filling core | Makoto Iijima, Tetsushi Wakabayashi, Masaharu Minamizawa, Masashi Takenaka, Taturou Yamashita +1 more | 1998-03-17 |
| 5497032 | Semiconductor device and lead frame therefore | Kazuto Tsuji, Yoshiyuki Yoneda, Hideharu Sakoda, Michio Sono, Ichiro Yamaguchi +5 more | 1996-03-05 |
| 5407502 | Method for producing a semiconductor device having an improved adhesive structure | Takeshi Takenaka, Takekiyo Saito | 1995-04-18 |