Issued Patents All Time
Showing 25 most recent of 61 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10926431 | Tool head and glass or glass ceramic article producible using the tool head | Stefan Mischke, Marco Weisenburger | 2021-02-23 |
| 10711311 | Genomic rearrangements associated with prostate cancer and methods of using the same | Shiv Srivastava, Albert Dobi, Gyorgy Petrovics, Martin Seifert, Matthias Scherf | 2020-07-14 |
| 10370284 | Monolithic support for full-surface support of a workpiece | Thorsten Gehindy, Armin Thomas, Marco Weisenburger | 2019-08-06 |
| 10014279 | Methods of forming 3-D integrated semiconductor devices having intermediate heat spreading capabilities | Michael Grillberger, Frank Feustel | 2018-07-03 |
| 9822377 | Mutant CD83 promoter and use thereof | Alexander Steinkasserer, Marcello Stein, Ilka Knippertz | 2017-11-21 |
| 9627317 | Wafer with improved plating current distribution | Oliver Aubel, Frank Feustel | 2017-04-18 |
| 9455232 | Semiconductor structure including a die seal leakage detection material, method for the formation thereof and method including a test of a semiconductor structure | Frank Feustel, Oliver Aubel | 2016-09-27 |
| 9362239 | Vertical breakdown protection layer | Oliver Aubel, Georg Talut | 2016-06-07 |
| 9349641 | Wafer with improved plating current distribution | Oliver Aubel, Frank Feustel | 2016-05-24 |
| 9318468 | 3-D integrated semiconductor device comprising intermediate heat spreading capabilities | Michael Grillberger, Frank Feustel | 2016-04-19 |
| 9245860 | Metallization system of a semiconductor device including metal pillars having a reduced diameter at the bottom | Frank Feustel, Kai Frohberg | 2016-01-26 |
| 8835303 | Metallization system of a semiconductor device comprising extra-tapered transition vias | Frank Feustel, Kai Frohberg | 2014-09-16 |
| 8828887 | Restricted stress regions formed in the contact level of a semiconductor device | Kai Frohberg, Frank Feustel | 2014-09-09 |
| 8735237 | Method for increasing penetration depth of drain and source implantation species for a given gate height | Uwe Griebenow, Kai Frohberg, Frank Feustel | 2014-05-27 |
| 8716126 | Semiconductor device comprising self-aligned contact bars and metal lines with increased via landing regions | Peter Baars, Frank Feustel | 2014-05-06 |
| 8679924 | Self-aligned multiple gate transistor formed on a bulk substrate | Andy Wei, Vivien Schroeder, Thilo Scheiper, Johannes Groschopf | 2014-03-25 |
| 8652341 | Method and apparatus for structuring components made of a material composed of silicon oxide | Thomas Gessner, Andreas Bertz, Reinhard Schubert, Wolfgang Hentsch, Reinhard Fendler +1 more | 2014-02-18 |
| 8609524 | Method for making semiconductor device comprising replacement gate electrode structures with an enhanced diffusion barrier | Kai Frohberg, Frank Feustal | 2013-12-17 |
| 8482123 | Stress reduction in chip packaging by using a low-temperature chip-package connection regime | Michael Grillberger, Matthias Lehr | 2013-07-09 |
| 8420533 | Metallization system of a semiconductor device comprising rounded interconnects formed by hard mask rounding | Robert Seidel | 2013-04-16 |
| 8399352 | Semiconductor device comprising self-aligned contact bars and metal lines with increased via landing regions | Peter Baars, Frank Feustel | 2013-03-19 |
| 8377820 | Method of forming a metallization system of a semiconductor device by using a hard mask for defining the via size | Kai Frohberg, Frank Feustel | 2013-02-19 |
| 8368221 | Hybrid contact structure with low aspect ratio contacts in a semiconductor device | Frank Feustel, Kai Frohberg | 2013-02-05 |
| 8357610 | Reducing patterning variability of trenches in metallization layer stacks with a low-k material by reducing contamination of trench dielectrics | Frank Feustel, Michael Grillberger, Kai Frohberg | 2013-01-22 |
| 8344474 | Microstructure device including a metallization structure with self-aligned air gaps and refilled air gap exclusion zones | Robert Seidel | 2013-01-01 |