TK

Terence L. Kane

IBM: 35 patents #2,774 of 70,183Top 4%
Infineon Technologies Ag: 2 patents #3,160 of 7,486Top 45%
Globalfoundries: 1 patents #2,221 of 4,424Top 55%
GU Globalfoundries U.S.: 1 patents #22 of 211Top 15%
Overall (All Time): #90,281 of 4,157,543Top 3%
37
Patents All Time

Issued Patents All Time

Showing 26–37 of 37 patents

Patent #TitleCo-InventorsDate
6894522 Specific site backside underlaying and micromasking method for electrical characterization of semiconductor devices Barbara A. Averill, Darrell L. Miles, Richard W. Oldrey, John D. Sylvestri 2005-05-17
6887783 Bilayer HDP CVD/PE CVD cap in advance BEOL interconnect structures and method thereof Tze-Chiang Chen, Brett H. Engel, John A. Fitzsimmons, Naftall E. Lustig, Ann McDonald +5 more 2005-05-03
6888224 Methods and systems for fabricating electrical connections to semiconductor structures incorporating low-k dielectric materials Michael P. Tenney 2005-05-03
6884641 Site-specific methodology for localization and analyzing junction defects in mosfet devices John Bruley, Michael P. Tenney, Yun-Yu Wang 2005-04-26
6858530 Method for electrically characterizing charge sensitive semiconductor devices Lawrence Fischer, Steven B. Herschbein, Ying Hong, Michael P. Tenney 2005-02-22
6852629 Backside integrated circuit die surface finishing technique and tool Darrell L. Miles 2005-02-08
6790125 Backside integrated circuit die surface finishing technique and tool Darrell L. Miles 2004-09-14
6703641 Structure for detecting charging effects in device processing Yun-Yu Wang, Malcolm P. Cambra, Jr., Michael P. Tenney 2004-03-09
6670717 Structure and method for charge sensitive electrical devices Lawrence Fischer, Steven B. Herschbein, Ying Hong, Michael P. Tenney 2003-12-30
6630395 Methods for fabricating electrical connections to semiconductor structures incorporating low-k dielectric materials Michael P. Tenney 2003-10-07
6593660 Plasma treatment to enhance inorganic dielectric adhesion to copper Leena Paivikki Buchwalter, Barbara Luther, Paul D. Agnello, John P. Hummel, Dirk Manger +3 more 2003-07-15
6261951 Plasma treatment to enhance inorganic dielectric adhesion to copper Leena Paivikki Buchwalter, Barbara Luther, Paul D. Agnello, John P. Hummel, Dirk Manger +3 more 2001-07-17