| 8111903 |
Inline low-damage automated failure analysis |
Ronald C. Geiger, Jr., George Y. Gu, Oleg Gluschenkov, Xu Ouyang |
2012-02-07 |
| 7867910 |
Method of accessing semiconductor circuits from the backside using ion-beam and gas-etch |
Carmelo F. Scrudato, George Y. Gu, Loren L. Hahn |
2011-01-11 |
| 7781733 |
In-situ high-resolution light-optical channel for optical viewing and surface processing in parallel with charged particle (FIB and SEM) techniques |
Herschel M. Marchman, Narender Rana, Chad Rue |
2010-08-24 |
| 7351966 |
High-resolution optical channel for non-destructive navigation and processing of integrated circuits |
Herschel M. Marchman, Chad Rue, Michael Renner, Narender Rana |
2008-04-01 |
| 7119333 |
Ion detector for ion beam applications |
Narender Rana, Chad Rue, Michael Sievers |
2006-10-10 |
| 6987067 |
Semiconductor copper line cutting method |
Lawrence Fischer |
2006-01-17 |
| 6946064 |
Sample mount for performing sputter-deposition in a focused ion beam (FIB) tool |
Lawrence Fischer, Chad Rue |
2005-09-20 |
| 6900137 |
Dry etch process to edit copper lines |
Ville S. Kiiskinen, Chad Rue, Carmelo F. Scrudato, Michael Sievers |
2005-05-31 |
| 6858530 |
Method for electrically characterizing charge sensitive semiconductor devices |
Terence L. Kane, Lawrence Fischer, Ying Hong, Michael P. Tenney |
2005-02-22 |
| 6843893 |
Metal dry etch using electronic field |
Herschel M. Marchman, Chad Rue, Michael Sievers |
2005-01-18 |
| 6730237 |
Focused ion beam process for removal of copper |
Michael Sievers, Aaron Shore |
2004-05-04 |
| 6670717 |
Structure and method for charge sensitive electrical devices |
Terence L. Kane, Lawrence Fischer, Ying Hong, Michael P. Tenney |
2003-12-30 |
