| 7993504 |
Backside unlayering of MOSFET devices for electrical and physical characterization |
Terence L. Kane, John D. Sylvestri, Michael P. Tenney |
2011-08-09 |
| 7961307 |
Angular spectrum tailoring in solid immersion microscopy for circuit analysis |
Stephen Bradley Ippolito, Peilin Song, John D. Sylvestri |
2011-06-14 |
| 7826045 |
Angular spectrum tailoring in solid immersion microscopy for circuit analysis |
Stephen Bradley Ippolito, Peilin Song, John D. Sylvestri |
2010-11-02 |
| 7371689 |
Backside unlayering of MOSFET devices for electrical and physical characterization |
Terence L. Kane, John D. Sylvestri, Michael P. Tenney |
2008-05-13 |
| 7112983 |
Apparatus and method for single die backside probing of semiconductor devices |
Patrick J. McGinnis, Richard W. Oldrey, John D. Sylvestri, Manuel J. Villalobos |
2006-09-26 |
| 7015146 |
Method of processing backside unlayering of MOSFET devices for electrical and physical characterization including a collimated ion plasma |
Terence L. Kane, John D. Sylyestri, Michael P. Tenney |
2006-03-21 |
| 6894522 |
Specific site backside underlaying and micromasking method for electrical characterization of semiconductor devices |
Barbara A. Averill, Terence L. Kane, Richard W. Oldrey, John D. Sylvestri |
2005-05-17 |
| 6852629 |
Backside integrated circuit die surface finishing technique and tool |
Terence L. Kane |
2005-02-08 |
| 6790125 |
Backside integrated circuit die surface finishing technique and tool |
Terence L. Kane |
2004-09-14 |
