| 12002846 |
Integrated circuits having dielectric layers including an anti-reflective coating |
Poornika Fernandes, David M. Curran, Bhaskar Srinivasan, Guruvayurappan Mathur, Scott Jessen +3 more |
2024-06-04 |
| 11094644 |
Integrated circuit with scribe lane patterns for defect reduction |
Adrian Salinas, William K. McDonald, Scott Alexander JOHANNESMEYER, Robert Paul LUCKIN |
2021-08-17 |
| 10608075 |
Analog capacitor on submicron pitch metal level |
Bhaskar Srinivasan, Guru Mathur, Shih Chang Chang, Corinne Ann Gagnet |
2020-03-31 |
| 10177215 |
Analog capacitor on submicron pitch metal level |
Bhaskar Srinivasan, Guru Mathur, Shih Chang Chang, Corinne Ann Gagnet |
2019-01-08 |
| 8466569 |
Increasing exposure tool alignment signal strength for a ferroelectric capacitor layer |
Scott R. Summerfelt |
2013-06-18 |
| 8431463 |
Capacitor contact formed concurrently with bond pad metallization |
Maxwell Lippitt, Lee Alan Stringer, Stephen F. Clark, Fred Percy Debnam, II, Byron Lovell Williams |
2013-04-30 |
| 8324742 |
Alignment mark for opaque layer |
Scott R. Summerfelt, John B. Robbins |
2012-12-04 |
| 8268696 |
Alignment mark for opaque layer |
Scott R. Summerfelt, John B. Robbins |
2012-09-18 |
| 8236703 |
Methods for removing contaminants from aluminum-comprising bond pads and integrated circuits therefrom |
Alfred Griffin, Lisa A. Fritz, Lin Li, Lee Alan Stringer, Neel Bhatt +2 more |
2012-08-07 |
| 6985229 |
Overlay metrology using scatterometry profiling |
Cynthia C. Lee, Thomas Wolf, Alberto Santoni, John M. McIntosh |
2006-01-10 |
| 6893806 |
Multiple purpose reticle layout for selective printing of test circuits |
Cheryl Anne Bollinger, Seungmoo Choi, William T. Cochran, Daniel Mark Wroge, Gerard Zaneski |
2005-05-17 |