Issued Patents All Time
Showing 1–25 of 58 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10519000 | Sheet processing apparatus and image forming system including multiple folding members | Ken Sawada, Hiroyuki Kuno, Takuya Fukuhara | 2019-12-31 |
| 10510638 | Electronic component-embedded board | Tomoya Kubo, Katsuya Fukase | 2019-12-17 |
| 10124981 | Sheet processing apparatus and image forming system including multiple folding members | Ken Sawada, Hiroyuki Kuno, Takuya Fukuhara | 2018-11-13 |
| 9688502 | Sheet processing apparatus and image forming system for forming a folding line on a sheet | Ken Sawada, Hiroyuki Kuno, Takuya Fukuhara | 2017-06-27 |
| 8956512 | Magnetron sputtering apparatus and film forming method | — | 2015-02-17 |
| 8716132 | Radiation-assisted selective deposition of metal-containing cap layers | Tadahiro Ishizaka | 2014-05-06 |
| 8617363 | Magnetron sputtering apparatus | Hiroyuki Toshima | 2013-12-31 |
| 8372739 | Diffusion barrier for integrated circuits formed from a layer of reactive metal and method of fabrication | Tadahiro Ishizaka, Satohiko Hoshino, Kuzuhiro Hamamoto, Yasushi Mizusawa | 2013-02-12 |
| 8242019 | Selective deposition of metal-containing cap layers for semiconductor devices | Tadahiro Ishizaka, Satohiko Hoshino, Hiroyuki Nagai, Yuki Chiba, Frank M. Cerio, Jr. | 2012-08-14 |
| 8076241 | Methods for multi-step copper plating on a continuous ruthenium film in recessed features | Frank M. Cerio, Jr., Jonathan D. Reid, Thomas A. Ponnuswamy | 2011-12-13 |
| 8058728 | Diffusion barrier and adhesion layer for an interconnect structure | Tadahiro Ishizaka | 2011-11-15 |
| 8026168 | Semiconductor device containing an aluminum tantalum carbonitride barrier film and method of forming | Tadahiro Ishizaka | 2011-09-27 |
| 7935393 | Method and system for improving sidewall coverage in a deposition system | Takashi Sakuma, Yasushi Mizusawa | 2011-05-03 |
| 7848077 | Electrostatic chuck device | Masahito Ishihara, Sunil Wickramanayaka, Naoki Miyazaki | 2010-12-07 |
| 7846841 | Method for forming cobalt nitride cap layers | Tadahiro Ishizaka, Miho Jomen | 2010-12-07 |
| 7807561 | Method for forming side wirings | Takashi Kurihara, Akinori Shiraishi, Kei Murayama, Mitsutoshi Higashi | 2010-10-05 |
| 7799681 | Method for forming a ruthenium metal cap layer | Kenji Suzuki, Frank M. Cerio, Jr., Miho Jomen, Yasushi Mizusawa, Tadahiro Ishizaka | 2010-09-21 |
| 7791857 | Electrostatic chuck device | Masahito Ishihara, Sunil Wickramanayaka, Naoki Miyazaki | 2010-09-07 |
| 7777349 | Semiconductor apparatus having side surface wiring | Kei Murayama, Takashi Kurihara, Akinori Shiraishi, Mitsutoshi Higashi | 2010-08-17 |
| 7750484 | Semiconductor device with flip-chip connection that uses gallium or indium as bonding material | Takashi Kurihara | 2010-07-06 |
| 7731187 | Sheet medium adjustment apparatus and image formation system capable of sorting sheet media | Toru Horio, Minoru Hattori, Ikumi Takashima, Koji Furuta, Masanobu Kimata +5 more | 2010-06-08 |
| 7727883 | Method of forming a diffusion barrier and adhesion layer for an interconnect structure | Tadahiro Ishizaka | 2010-06-01 |
| 7724493 | Electrostatic chuck device | Masahito Ishihara, Sunil Wickramanayaka, Naoki Miyazaki | 2010-05-25 |
| 7718527 | Method for forming cobalt tungsten cap layers | Tadahiro Ishizaka, Miho Jomen | 2010-05-18 |
| 7642201 | Sequential tantalum-nitride deposition | Frank M. Cerio, Jr., Tsukasa Matsuda, Adam Selsey | 2010-01-05 |