Issued Patents All Time
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11145603 | Integrated circuit packaging system with shielding and method of manufacture thereof | Byung Joon Han, Il Kwon Shim, KyoungHee Park, Yaojian Lin, KyoWang Koo +5 more | 2021-10-12 |
| 11024585 | Integrated circuit packaging system with shielding and method of manufacture thereof | Byung Joon Han, Il Kwon Shim, KyoungHee Park, Yaojian Lin, KyoWang Koo +5 more | 2021-06-01 |
| 10319684 | Dummy conductive structures for EMI shielding | InSang Yoon, Soyeon Park | 2019-06-11 |
| 10109587 | Integrated circuit packaging system with substrate and method of manufacture thereof | Dao Nguyen Phu Cuong, Bartholomew Liao Chung Foh, Byung Tai Do, Kyung-Moon Kim, Jeffrey D. Punzalan +3 more | 2018-10-23 |
| 9997468 | Integrated circuit packaging system with shielding and method of manufacturing thereof | Byung Joon Han, Il Kwon Shim, KyoungHee Park, Yaojian Lin, KyoWang Koo +5 more | 2018-06-12 |
| 9412624 | Integrated circuit packaging system with substrate and method of manufacture thereof | Dao Nguyen Phu Cuong, Bartholomew Liao Chung Foh, Byung Tai Do, Kyung-Moon Kim, Jeffrey D. Punzalan +3 more | 2016-08-09 |
| 9279673 | Semiconductor device and method of calibrating warpage testing system to accurately measure semiconductor package warpage | WonJun Ko, OhHan Kim, GwangTae Kim, Kenny Lee | 2016-03-08 |
| 8524537 | Semiconductor device and method of forming protective coating material over semiconductor wafer to reduce lamination tape residue | JaEun Yun, HunTeak Lee, WonJun Ko | 2013-09-03 |
| 8518822 | Integrated circuit packaging system with multi-stacked flip chips and method of manufacture thereof | Sang Ho Lee | 2013-08-27 |
| 8067275 | Integrated circuit package system with package integration | WonJun Ko, Jong Wook Ju, Taeg Ki Lim, Ja Eun Yun | 2011-11-29 |