Issued Patents All Time
Showing 25 most recent of 40 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7842553 | Cooling micro-channels | Sarah Kim, Alan M. Myers | 2010-11-30 |
| 7723208 | Integrated re-combiner for electroosmotic pumps using porous frits | Sarah Kim, James G. Maveety, Alan M. Myers, Quat Vu | 2010-05-25 |
| 7696015 | Method of forming a stack of heat generating integrated circuit chips with intervening cooling integrated circuit chips | Sarah Kim, James G. Maveety, Alan M. Myers, Quat Vu | 2010-04-13 |
| 7667319 | Electroosmotic pump using nanoporous dielectric frit | Alan M. Myers, Quat Vu | 2010-02-23 |
| 7615462 | Etch stop layer for silicon (Si) via etch in three-dimensional (3-D) wafer-to-wafer vertical stack | Sarah Kim, Tom Letson | 2009-11-10 |
| 7576432 | Using external radiators with electroosmotic pumps for cooling integrated circuits | Sarah Kim, James G. Maveety, Alan M. Myers, Quat Vu, Ravi Prasher +2 more | 2009-08-18 |
| 7569426 | Apparatus and method integrating an electro-osmotic pump and microchannel assembly into a die package | Alan M. Myers, Gilroy Vandentop | 2009-08-04 |
| 7537954 | Microelectronic assembly having thermoelectric elements to cool a die and a method of making the same | Shriram Ramanathan, Sarah Kim, Gregory M. Chrysler | 2009-05-26 |
| 7355277 | Apparatus and method integrating an electro-osmotic pump and microchannel assembly into a die package | Alan M. Myers, Gilroy Vandentop | 2008-04-08 |
| 7348217 | Method and structure for interfacing electronic devices | Mauro J. Kobrinsky, Sarah Kim, Michael C. Harmes | 2008-03-25 |
| 7300871 | Method of doping a conductive layer near a via | Stefan Hau-Riege | 2007-11-27 |
| 7274106 | Packaged electroosmotic pumps using porous frits for cooling integrated circuits | Sarah Kim, James G. Maveety, Alan M. Myers, Quat Vu | 2007-09-25 |
| 7227257 | Cooling micro-channels | Sarah Kim, Alan M. Myers | 2007-06-05 |
| 7157787 | Process of vertically stacking multiple wafers supporting different active integrated circuit (IC) devices | Sarah Kim, Scot Kellar | 2007-01-02 |
| 7148565 | Etch stop layer for silicon (Si) via etch in three-dimensional (3-D) wafer-to-wafer vertical stack | Sarah Kim, Tom Letson | 2006-12-12 |
| 7129172 | Bonded wafer processing method | Patrick Morrow, Michael Chan | 2006-10-31 |
| 7120817 | Method of signal distribution based on a standing wave within a closed loop path | Mauro J. Kobrinsky, Sourav Chakravarty | 2006-10-10 |
| 7105382 | Self-aligned electrodes contained within the trenches of an electroosmotic pump | Alan M. Myers, Sarah Kim | 2006-09-12 |
| 7084495 | Electroosmotic pumps using porous frits for cooling integrated circuit stacks | Sarah Kim, James G. Maveety, Alan M. Myers, Quat Vu | 2006-08-01 |
| 7056813 | Methods of forming backside connections on a wafer stack | Patrick Morrow, Sarah Kim | 2006-06-06 |
| 7056807 | Barrier structure against corrosion and contamination in three-dimensional (3-D) wafer-to-wafer vertical stack | Scot Kellar, Sarah Kim | 2006-06-06 |
| 7037804 | Wafer bonding using a flexible bladder press for three dimensional (3D) vertical stack integration | Scot Kellar, Sarah Kim | 2006-05-02 |
| 7034394 | Microelectronic assembly having thermoelectric elements to cool a die and a method of making the same | Shriram Ramanathan, Sarah Kim, Gregory M. Chrysler | 2006-04-25 |
| 6992381 | Using external radiators with electroosmotic pumps for cooling integrated circuits | Sarah Kim, James G. Maveety, Alan M. Myers, Quat Vu, Ravi Prasher +2 more | 2006-01-31 |
| 6981849 | Electro-osmotic pumps and micro-channels | Sarah Kim, James G. Maveety, Alan M. Myers, Quat Vu, Ravi Prasher +1 more | 2006-01-03 |