Issued Patents All Time
Showing 1–13 of 13 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12057381 | Circuit board having laminated build-up layers | Chih-Chiang Lu, Hsin-Ning Liu, Jun-Rui Huang, Ching-Sheng Chen, Shih-Lian Cheng | 2024-08-06 |
| 11792918 | Co-axial via structure | Heng-Ming Nien, Ching-Sheng Chen, Yi-Pin Lin, Shih-Liang Cheng | 2023-10-17 |
| 11641720 | Circuit board and manufacturing method thereof | Shao-Chien Lee, Ra-Min Tain, Chi-Chun Po, Po-Hsiang Wang, Pei-Chang Huang +1 more | 2023-05-02 |
| 11600936 | Circuit board structure | Tzyy-Jang Tseng, Ching-Ho Hsieh, Shao-Chien Lee, Kuo-Wei Li | 2023-03-07 |
| 11562972 | Manufacturing method of the chip package structure having at least one chip and at least one thermally conductive element | John Hon-Shing Lau, Yu-Chi Shen, Tzyy-Jang Tseng, Chen-Hua Cheng | 2023-01-24 |
| 11545412 | Package structure and manufacturing method thereof | Ching-Sheng Chen, Ra-Min Tain, Ming-Hao Wu, Hsuan-Wei Chen | 2023-01-03 |
| 11145610 | Chip package structure having at least one chip and at least one thermally conductive element and manufacturing method thereof | John Hon-Shing Lau, Yu-Chi Shen, Tzyy-Jang Tseng, Chen-Hua Cheng | 2021-10-12 |
| 11114782 | Method of manufacturing circuit board structure | Tzyy-Jang Tseng, Ching-Ho Hsieh, Shao-Chien Lee, Kuo-Wei Li | 2021-09-07 |
| 10863618 | Composite substrate structure and manufacturing method thereof | Tzyy-Jang Tseng, Bo-Cheng Lin, Chun-Hsien Chien, Chien-Chou Chen | 2020-12-08 |
| 10854803 | Manufacturing method of light emitting device package structure with circuit redistribution structure | Cheng-Ta Ko, Yu-Hua Chen, De-Shiang LIU, Tzyy-Jang Tseng | 2020-12-01 |
| 10651358 | Light emitting device package structure with circuit redistribution structure and manufacturing method thereof | Cheng-Ta Ko, Yu-Hua Chen, De-Shiang LIU, Tzyy-Jang Tseng | 2020-05-12 |
| 10573269 | Data transmission method and electronic device | Wei Zhang, Zhifeng Yang, Wenlin Hou, Yanlin Zhu, Daye Yang | 2020-02-25 |
| 9239593 | Information processing equipment | Yanlin Zhu, Huang Dai, Wei Zhang, Zhifeng Yang, Wenlin Hou +1 more | 2016-01-19 |