| 12293956 |
Boiling enhancement structures for immersion cooled electronic systems |
Jin Yang, Jimmy Chuang, Xicai Jing, Yuan-Liang Li, Yuyang XIA +9 more |
2025-05-06 |
| 12248344 |
Technologies for liquid cooling interfaces |
Kristin L. Weldon, David Rodriguez, Jin Yang, David Shia, Jimmy Chuang +1 more |
2025-03-11 |
| 12176643 |
Compression mounted technology (CMT) socket system retention mechanisms designs for shipping reliability risk mitigation |
Thomas A. Boyd, Feifei Cheng, Eric W. Buddrius |
2024-12-24 |
| 12133357 |
Cold plate architecture for liquid cooling of devices |
Jin Yang, David Shia, Olaotan ELENITOBA-JOHNSON, Craig Jahne, Phil Geng |
2024-10-29 |
| 12127363 |
Compression mounted technology (CMT) socket retention mechanisms to board or interposer |
Feifei Cheng, Thomas A. Boyd, Kuang Liu, Steven A. Klein, Daniel Neumann |
2024-10-22 |
| 11683890 |
Reflow grid array to support late attach of components |
Jonathan W. Thibado, Jeffory L. Smalley, John C. Gulick, Phi Thanh |
2023-06-20 |
| 11656247 |
Micro-coaxial wire interconnect architecture |
Ronald Michael Kirby, Erkan Acar, Joe Walczyk, Youngseok Oh, Justin Huttula |
2023-05-23 |
| 11621237 |
Interposer and electronic package |
Jonathan W. Thibado, Jeffory L. Smalley, John C. Gulick, Phi Thanh, Chong J. Zhao |
2023-04-04 |
| 11449111 |
Scalable, high load, low stiffness, and small footprint loading mechanism |
Eric W. Buddrius, Ralph V. Miele, David Shia, Jeffory L. Smalley |
2022-09-20 |
| 10644458 |
Shielded interconnect array |
Youngseok Oh, Justin Huttula, Ronald Michael Kirby, Joe Walczyk, Erkan Acar |
2020-05-05 |
| 10595439 |
Movable heatsink utilizing flexible heat pipes |
David Shia, Evan A. Chenelly |
2020-03-17 |
| 10324112 |
Package testing system and method with contact alignment |
Andrew Hoitink, Abram M. Detofsky, Joe Walczyk |
2019-06-18 |