Issued Patents All Time
Showing 25 most recent of 37 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12334455 | Semiconductor package with integrated capacitors | Michael Alfano, Siddharth Ravichandran | 2025-06-17 |
| 12288756 | Semiconductor package with integrated capacitors | Michael Alfano, Siddharth Ravichandran | 2025-04-29 |
| 12094853 | Semiconductor chip with redundant thru-silicon-vias | Bryan Black, Gamal Refai-Ahmed, Joe Siegel, Seth Prejean | 2024-09-17 |
| 11469212 | Semiconductor chip with redundant thru-silicon-vias | Bryan Black, Gamal Refai-Ahmed, Joe Siegel, Seth Prejean | 2022-10-11 |
| 10290606 | Interposer with identification system | Michael Alfano, Joe Siegel, Bryan Black, Julius Din | 2019-05-14 |
| 9806014 | Interposer with beyond reticle field conductor pads | Michael Alfano, Bryan Black, Joseph Siegel, Julius Din, Anwar Kashem | 2017-10-31 |
| 9793239 | Semiconductor workpiece with selective backside metallization | Michael Alfano, Bryan Black | 2017-10-17 |
| 9627281 | Semiconductor chip with thermal interface tape | Seth Prejean, Dales Morrison Kent, Ronnie Brandon, Gamal Refai-Ahmed, Michael D. Bienek +2 more | 2017-04-18 |
| 9449907 | Stacked semiconductor chips packaging | Lei Fu, Frank Kuechenmeister | 2016-09-20 |
| 9437561 | Semiconductor chip with redundant thru-silicon-vias | Bryan Black, Gamal Refai-Ahmed, Joe Siegel, Seth Prejean | 2016-09-06 |
| 9385055 | Stacked semiconductor chips with thermal management | Gamal Refai-Ahmed, Bryan Black, Maxat Touzelbaev, Yizhang Yang | 2016-07-05 |
| 8866276 | Semiconductor chip device with polymeric filler trench | Gamal Refai-Ahmed, Bryan Black | 2014-10-21 |
| 8796842 | Stacked semiconductor chip device with thermal management circuit board | Gamal Refai-Ahmed, Bryan Black | 2014-08-05 |
| 8759962 | Semiconductor chip device with solder diffusion protection | — | 2014-06-24 |
| 8749254 | Power cycling test arrangement | — | 2014-06-10 |
| 8723314 | Semiconductor workpiece with backside metallization and methods of dicing the same | Lei Fu, Edward S. Alcid | 2014-05-13 |
| 8704353 | Thermal management of stacked semiconductor chips with electrically non-functional interconnects | Bryan Black, Neil McLellan, Joe Siegel, Michael Alfano | 2014-04-22 |
| 8691626 | Semiconductor chip device with underfill | Lei Fu, Gamal Refai-Ahmed, Bryan Black | 2014-04-08 |
| 8647974 | Method of fabricating a semiconductor chip with supportive terminal pad | Roden R. Topacio, Neil McLellan | 2014-02-11 |
| 8624404 | Integrated circuit package having offset vias | Lei Fu, Frank Kuechenmeister | 2014-01-07 |
| 8617926 | Semiconductor chip device with polymeric filler trench | Gamal Refai-Ahmed, Bryan Black | 2013-12-31 |
| 8574965 | Semiconductor chip device with liquid thermal interface material | Gamal Refai-Ahmed, Bryan Black | 2013-11-05 |
| 8472190 | Stacked semiconductor chip device with thermal management | Gamal Refai-Ahmed, Bryan Black | 2013-06-25 |
| 8394672 | Method of manufacturing and assembling semiconductor chips with offset pads | Gamal Refai-Ahmed, Bryan Black | 2013-03-12 |
| 8338961 | Semiconductor chip with reinforcing through-silicon-vias | Gamal Refai-Ahmed, Bryan Black | 2012-12-25 |