Issued Patents All Time
Showing 1–24 of 24 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10424510 | Solder fill into high aspect through holes | Toyohiro Aoki, Akihiro Horibe, Kuniaki Sueoka | 2019-09-24 |
| 10388566 | Solder fill into high aspect through holes | Toyohiro Aoki, Akihiro Horibe, Kuniaki Sueoka | 2019-08-20 |
| 10252363 | Forming a solder joint between metal layers | Toyohiro Aoki, Akihiro Horibe, Hiroyuki Mori, Yasumitsu Orii, Ting-Li Yang | 2019-04-09 |
| 10141278 | Chip mounting structure | Akihiro Horibe, Keiji Matsumoto, Keishi Okamoto | 2018-11-27 |
| 10090586 | Wireless communication device with joined semiconductors | Toyohiro Aoki, Noam Kaminski, Keishi Okamoto | 2018-10-02 |
| 9941230 | Electrical connecting structure between a substrate and a semiconductor chip | Keiji Matsumoto, Keishi Okamoto, Yasumitsu Orii | 2018-04-10 |
| 9893031 | Chip mounting structure | Akihiro Horibe, Keiji Matsumoto, Keishi Okamoto | 2018-02-13 |
| 9780442 | Wireless communication device with joined semiconductors | Toyohiro Aoki, Noam Kaminski, Keishi Okamoto | 2017-10-03 |
| 9772462 | Via for electrical contact passing through layers of optical waveguide in multilayer structure including electrical substrate and laminated layers of optical waveguide | Hirokazu Noma, Keishi Okamoto, Masao Tokunari, Yutaka Tsukada | 2017-09-26 |
| 9698119 | Interfacial alloy layer for improving electromigration (EM) resistance in solder joints | Hirokazu Noma, Yasumitsu Orii | 2017-07-04 |
| 9586281 | Forming a solder joint between metal layers | Toyohiro Aoki, Akihiro Horibe, Hiroyuki Mori, Yasumitsu Orii, Ting-Li Yang | 2017-03-07 |
| 9520375 | Method of forming a solder bump on a substrate | Toyohiro Aoki, Hiroyuki Mori, Yasumitsu Orii, Shintaro Yamamichi | 2016-12-13 |
| 9508594 | Fabricating pillar solder bump | Toyohiro Aoki, Hiroyuki Mori | 2016-11-29 |
| 9466533 | Semiconductor structure including a through electrode, and method for forming the same | Akihiro Horibe, Hiroyuki Mori, Yasumitsu Orii, Kuniaki Sueoka | 2016-10-11 |
| 9391034 | Interfacial alloy layer for improving electromigration (EM) resistance in solder joints | Hirokazu Noma, Yasumitsu Orii | 2016-07-12 |
| 9373545 | Semiconductor structure including a through electrode, and method for forming the same | Akihiro Horibe, Hiroyuki Mori, Yasumitsu Orii, Kuniaki Sueoka | 2016-06-21 |
| 9354408 | Via for electrical contact passing through layers of optical waveguide in multilayer structure including electrical substrate and laminated layers of optical waveguide | Hirokazu Noma, Keishi Okamoto, Masao Tokunari, Yutaka Tsukada | 2016-05-31 |
| 9299606 | Fabricating pillar solder bump | Toyohiro Aoki, Hiroyuki Mori | 2016-03-29 |
| 9219041 | Electronic package for millimeter wave semiconductor dies | Danny Elad, Noam Kaminski, Keishi Okamoto, Evgeny Shumaker | 2015-12-22 |
| 9099315 | Mounting structure and mounting structure manufacturing method | Sayuri Hada, Kei Kawase, Keiji Matsumoto, Yasumitsu Orii | 2015-08-04 |
| 8971678 | Spacer resin pattern helping to reduce optical coupling loss in optical waveguide for light-emitting element or light-receiving element on semiconductor | Daiju Nakano, Masao Tokunari, Yutaka Tsukada | 2015-03-03 |
| 8381962 | Injection molded solder method for forming solder bumps on substrates | Peter A. Gruber, Paul A. Lauro, Jae-Woong Nah | 2013-02-26 |
| 7931187 | Injection molded solder method for forming solder bumps on substrates | Peter A. Gruber, Paul A. Lauro, Jae-Woong Nah | 2011-04-26 |
| 7674651 | Mounting method for semiconductor parts on circuit substrate | Yukifumi Oyama, Hidetoshi Nishiwaki, Toshihiko Nishio, Yasumitsu Orii | 2010-03-09 |