Issued Patents All Time
Showing 25 most recent of 33 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12191241 | Fine pitch copper pillar package and method | Robert Francis Darveaux, David McCann, Louis W. Nicholls | 2025-01-07 |
| 11088064 | Fine pitch copper pillar package and method | Robert Francis Darveaux, David McCann, Louis W. Nicholls | 2021-08-10 |
| 10418318 | Fine pitch copper pillar package and method | Robert Francis Darveaux, David McCann, Louis W. Nicholls | 2019-09-17 |
| 10224270 | Fine pitch copper pillar package and method | Robert Francis Darveaux, David McCann, Louis W. Nicholls | 2019-03-05 |
| 9462690 | Fine pitch copper pillar package and method | Robert Francis Darveaux, David McCann, Louis W. Nicholls | 2016-10-04 |
| 8786075 | Electrical circuit with component-accommodating lid | Jeffery Alan Miks | 2014-07-22 |
| 8536458 | Fine pitch copper pillar package and method | Robert Francis Darveaux, David McCann, Louis W. Nicholls | 2013-09-17 |
| 7041516 | Multi chip module assembly | Sarathy Rajagopalan, Kishor Desai, Maniam Alagaratnam | 2006-05-09 |
| 6943446 | Via construction for structural support | Ivor G. Barber, Kumar Nagarajan | 2005-09-13 |
| 6777314 | Method of forming electrolytic contact pads including layers of copper, nickel, and gold | Kishor Desai, Maniam Alagaratnam | 2004-08-17 |
| 6706622 | Bonding pad interface | — | 2004-03-16 |
| 6558978 | Chip-over-chip integrated circuit package | — | 2003-05-06 |
| 6431432 | Method for attaching solderballs by selectively oxidizing traces | Kishor Desai | 2002-08-13 |
| 6369448 | Vertically integrated flip chip semiconductor package | — | 2002-04-09 |
| 6294840 | Dual-thickness solder mask in integrated circuit package | — | 2001-09-25 |
| 6171888 | Multi-layer tab tape having distinct signal, power and ground planes, semiconductor device assembly employing same, apparatus for and method of assembling same | Brian Lynch | 2001-01-09 |
| 6166434 | Die clip assembly for semiconductor package | Kishor Desai, Sunil A. Patel | 2000-12-26 |
| 6008991 | Electronic system including packaged integrated circuits with heat spreading standoff support members | Emily Hawthorne | 1999-12-28 |
| 6002171 | Integrated heat spreader/stiffener assembly and method of assembly for semiconductor package | Kishor Desai, Sunil A. Patel | 1999-12-14 |
| 5909057 | Integrated heat spreader/stiffener with apertures for semiconductor package | Sunil A. Patel | 1999-06-01 |
| 5898575 | Support assembly for mounting an integrated circuit package on a surface | Emily Hawthorne | 1999-04-27 |
| 5854085 | Multi-layer tab tape having distinct signal, power and ground planes, semiconductor device assembly employing same, apparatus for and method of assembling same | Kurt Raab | 1998-12-29 |
| 5831836 | Power plane for semiconductor device | Jon M. Long | 1998-11-03 |
| 5801432 | Electronic system using multi-layer tab tape semiconductor device having distinct signal, power and ground planes | Michael D. Rostoker, Kurt Raab | 1998-09-01 |
| 5780924 | Integrated circuit underfill reservoir | — | 1998-07-14 |