| 9349666 |
Integrated circuit packaging system with package stacking |
In Sang Yoon, DaeSik Choi |
2016-05-24 |
| 9330945 |
Integrated circuit package system with multi-chip module |
Sungmin Song, SeungYun Ahn, Jong-Woo Ha |
2016-05-03 |
| 9093392 |
Integrated circuit packaging system with vertical interconnection and method of manufacture thereof |
SungWon Cho, DaeSik Choi, DongSoo Moon |
2015-07-28 |
| 9093391 |
Integrated circuit packaging system with fan-in package and method of manufacture thereof |
SeungYun Ahn, Sangjin Lee |
2015-07-28 |
| 8772916 |
Integrated circuit package system employing mold flash prevention technology |
Ki Youn Jang, Sungmin Song |
2014-07-08 |
| 8699232 |
Integrated circuit packaging system with interposer and method of manufacture thereof |
A Leam Choi, DeokKyung Yang |
2014-04-15 |
| 8698297 |
Integrated circuit packaging system with stack device |
In Sang Yoon, DaeSik Choi |
2014-04-15 |
| 8674516 |
Integrated circuit packaging system with vertical interconnects and method of manufacture thereof |
Byung Joon Han, In Sang Yoon |
2014-03-18 |
| 8643181 |
Integrated circuit packaging system with encapsulation and method of manufacture thereof |
SeongHun Mun, SeungYun Ahn |
2014-02-04 |
| 8569869 |
Integrated circuit packaging system with encapsulation and method of manufacture thereof |
HyungSang Park, A Leam Choi |
2013-10-29 |
| 8501535 |
Integrated circuit package system with dual side connection and method for manufacturing thereof |
Sungmin Song, SeungYun Ahn |
2013-08-06 |
| 8497575 |
Semiconductor packaging system with an aligned interconnect and method of manufacture thereof |
In Sang Yoon, DeokKyung Yang |
2013-07-30 |
| 8461680 |
Integrated circuit packaging system with rounded interconnect |
DaeSik Choi, SungWon Cho |
2013-06-11 |
| 8304900 |
Integrated circuit packaging system with stacked lead and method of manufacture thereof |
Ki Youn Jang, Youngjoon KIM |
2012-11-06 |
| 8252615 |
Integrated circuit package system employing mold flash prevention technology |
Ki Youn Jang, Sungmin Song |
2012-08-28 |
| 8232141 |
Integrated circuit packaging system with conductive pillars and method of manufacture thereof |
DaeSik Choi, Junghoon Shin |
2012-07-31 |
| 8129832 |
Mountable integrated circuit package system with substrate having a conductor-free recess |
Flynn Carson, In Sang Yoon, Seongmin Lee |
2012-03-06 |
| 8039275 |
Integrated circuit packaging system with rounded interconnect and method of manufacture thereof |
DaeSik Choi, SungWon Cho |
2011-10-18 |
| 7923304 |
Integrated circuit packaging system with conductive pillars and method of manufacture thereof |
DaeSik Choi, Junghoon Shin |
2011-04-12 |
| 7884457 |
Integrated circuit package system with dual side connection |
Sungmin Song, SeungYun Ahn |
2011-02-08 |
| 7800212 |
Mountable integrated circuit package system with stacking interposer |
In Sang Yoon, HanGil Shin |
2010-09-21 |
| 7710735 |
Multichip package system |
In Sang Yoon |
2010-05-04 |
| 7687897 |
Mountable integrated circuit package-in-package system with adhesive spacing structures |
Jong-Woo Ha, Seongmin Lee |
2010-03-30 |