Issued Patents All Time
Showing 1–25 of 29 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11261082 | Micromechanical device and method for manufacturing a micromechanical device | Eckhard Graf, Holger Rumpf, Jochen Reinmuth, Kurt-Ulrich Ritzau, Achim Breitling | 2022-03-01 |
| 10752498 | MEMS component having two different internal pressures | Achim Breitling, Eckhard Graf, Jochen Reinmuth, Mawuli Ametowobla | 2020-08-25 |
| 10000375 | Structures and process for preventing a projection of the laser resealing structure beyond the wafer surface | Frank Reichenbach, Jochen Reinmuth, Julia Amthor | 2018-06-19 |
| 9926188 | Sensor unit including a decoupling structure and manufacturing method therefor | Johannes Classen, Torsten Kramer, Hubert Benzel, Daniel Christoph Meisel, Christoph Schelling | 2018-03-27 |
| 9919919 | Laser reseal including an additional layer and alloy formation | Jochen Reinmuth, Mawuli Ametowobla, Philip Kappe | 2018-03-20 |
| 9688527 | Micromechanical component and method for producing a micromechanical component | Jochen Reinmuth | 2017-06-27 |
| 9606141 | Micromechanical sensor device | Arnd Kaelberer, Jochen Reinmuth, Johannes Classen | 2017-03-28 |
| 9567212 | Micromechanical component | Julian Gonska, Jochen Reinmuth, Kathrin Gutsche, Heribert Weber | 2017-02-14 |
| 9475693 | ASIC element, in particular as a component of a vertically integrated hybrid component | Daniel Christoph Meisel, Christoph Schelling, Torsten Kramer | 2016-10-25 |
| 9416000 | Component including two semiconductor elements, between which at least two hermetically sealed cavities are formed and method for establishing a corresponding bonding connection between two semiconductor elements | Christoph Schelling, Ralf Reichenbach, Antoine Puygranier | 2016-08-16 |
| 9406747 | Component in the form of a wafer level package and method for manufacturing same | Heribert Weber, Hartmut Kueppers, Neil Davies, Jochen Reinmuth | 2016-08-02 |
| 9365417 | Method for manufacturing a micromechanical component | Thomas Mayer, Heribert Weber | 2016-06-14 |
| 9266720 | Hybrid integrated component | Johannes Classen, Axel Franke, Heribert Weber, Frank Fischer, Patrick Wellner +2 more | 2016-02-23 |
| 9153523 | ASIC element including a via | Heribert Weber, Hartmut Kueppers, Jochen Reinmuth, Neil Davies | 2015-10-06 |
| 9123716 | Method for bonding two silicon substrates, and a correspondeing system of two silicon substrates | Julian Gonska, Heribert Weber, Timo Schary, Thomas Mayer | 2015-09-01 |
| 9114978 | Method for manufacturing a component having an electrical through-connection | Jochen Reinmuth, Yvonne Bergmann | 2015-08-25 |
| 9040336 | Method for manufacturing a cap for a MEMS component, and hybrid integrated component having such a cap | Johannes Classen, Axel Franke, Heribert Weber, Frank Fischer, Patrick Wellner | 2015-05-26 |
| 9034757 | Method for manufacturing a component having an electrical through-connection | Jochen Reinmuth, Yvonne Bergmann | 2015-05-19 |
| 8975118 | Component having a via and method for manufacturing it | Julian Gonska, Heribert Weber, Eckhard Graf, Roman Schlosser | 2015-03-10 |
| 8941193 | Method for manufacturing a hybrid integrated component | Frank Fischer | 2015-01-27 |
| 8835222 | Method for producing a two-chip assembly and corresponding two-chip assembly | Mathias Bruendel, Frieder Haag, Rolf Speicher, Juergen Fritz, Lutz Rauscher | 2014-09-16 |
| 8759927 | Hybrid intergrated component | Johannes Classen | 2014-06-24 |
| 8748998 | Sensor module | Heribert Weber, Eckhard Graf | 2014-06-10 |
| 8647961 | Method for filling cavities in wafers, correspondingly filled blind hole and wafer having correspondingly filled insulation trenches | Heribert Weber, Eckhard Graf, Roman Schlosser | 2014-02-11 |
| 8490483 | Micromechanical yaw-rate sensor | Martin Wrede, Johannes Classen, Torsten Ohms, Carsten Geckeler, Burkhard Kuhlmann +3 more | 2013-07-23 |