Issued Patents All Time
Showing 1–13 of 13 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12218070 | Semiconductor package and method of fabricating the same | Kyung Suk Oh | 2025-02-04 |
| 12080676 | Semiconductor package including a molding layer | — | 2024-09-03 |
| 11935867 | Semiconductor package with memory stack structure connected to logic dies via an interposer | Yanggyoo Jung, Sungeun Kim, Sangmin Yong | 2024-03-19 |
| 11637070 | Method of fabricating a semiconductor package | Kyung Suk Oh | 2023-04-25 |
| 11282792 | Semiconductor package having dummy pads and method of manufacturing semiconductor package having dummy pads | Young Kun Jee, Sangwon Kim, Un-Byoung Kang, Jongho Lee, Dae-Woo Kim +1 more | 2022-03-22 |
| 10854551 | Semiconductor package and method of fabricating the same | Kyung Suk Oh | 2020-12-01 |
| 9245867 | Package-on-package electronic devices including sealing layers and related methods of forming the same | Choongbin Yim, Taesung Park | 2016-01-26 |
| 9245863 | Semiconductor packaging apparatus formed from semiconductor package including first and second solder balls having different heights | Hak-Kyoon Byun, Kyung-Tae Na, Seung Hun Han, Tae-Sung Park, Choong Bin Yim | 2016-01-26 |
| 9054228 | Semiconductor packages including a heat spreader and methods of forming the same | Eun-Kyoung Choi, Jong Youn Kim, Sang Wook Park, In-Young Lee, Sang-Uk Han +1 more | 2015-06-09 |
| 8912048 | Method of fabricating semiconductor device including a substrate attached to a carrier | Jong Youn Kim, Ji Hwang Kim, Cha-Jea Jo | 2014-12-16 |
| 8779606 | Package-on-package electronic devices including sealing layers and related methods of forming the same | Choongbin Yim, Taesung Park | 2014-07-15 |
| 8592997 | Molded underfill flip chip package preventing warpage and void | Hyeong-Seob Kim, Jong Ho Lee, Jin-Woo Park | 2013-11-26 |
| 7923291 | Method of fabricating electronic device having stacked chips | Eun-Chul Ahn, Tae-Gyeong Chung, Nam-Seog Kim | 2011-04-12 |