Issued Patents All Time
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8580672 | Methods of forming bump structures that include a protection layer | Frank Kuechenmeister, Lothar Lehmann, Alexander Platz, Sven Kosgalwies | 2013-11-12 |
| 8384218 | Back side metallization with superior adhesion in high-performance semiconductor devices | Soeren Zenner, Frank Kuechenmeister | 2013-02-26 |
| 7829453 | Method for forming solder balls with a stable oxide layer by controlling the reflow ambient | Alexander Platz, Frank Kuechenmeister | 2010-11-09 |
| 7585759 | Technique for efficiently patterning an underbump metallization layer using a dry etch process | Frank Kuechenmeister, Alexander Platz, Kerstin Siury | 2009-09-08 |
| 7569937 | Technique for forming a copper-based contact layer without a terminal metal | Frank Kuechenmeister, Matthias Lehr | 2009-08-04 |
| 7491556 | Efficient method of forming and assembling a microelectronic chip including solder bumps | Frank Kuechenmeister, Daniel Richter, Marcel Wieland | 2009-02-17 |
| 6720242 | Method of forming a substrate contact in a field effect transistor formed over a buried insulator layer | Gert Burbach, Frank Heinlein, Johannes Groschopf, Hartmut Ruelke, Carsten Hartig | 2004-04-13 |