| 9431359 |
Coaxial solder bump support structure |
Brian M. Erwin, Ian D. Melville, Ekta Misra |
2016-08-30 |
| 9347147 |
Method and apparatus for controlling and monitoring the potential |
Charles L. Arvin, Harry D. Cox, Hariklia Deligianni |
2016-05-24 |
| 9062388 |
Method and apparatus for controlling and monitoring the potential |
Charles L. Arvin, Harry D. Cox, Hariklia Deligianni |
2015-06-23 |
| 8778792 |
Solder bump connections |
Timothy H. Daubenspeck, Jeffrey P. Gambino, Ekta Misra, Christopher D. Muzzy, Wolfgang Sauter |
2014-07-15 |
| 8710656 |
Redistribution layer (RDL) with variable offset bumps |
Timothy H. Daubenspeck, Brian M. Erwin, Jeffrey P. Gambino, Wolfgang Sauter |
2014-04-29 |
| 8674506 |
Structures and methods to reduce maximum current density in a solder ball |
Raschid J. Bezama, Timothy H. Daubenspeck, Gary LaFontant, Ian D. Melville, Ekta Misra +6 more |
2014-03-18 |
| 8563416 |
Coaxial solder bump support structure |
Brian M. Erwin, Ian D. Melville, Ekta Misra |
2013-10-22 |
| 8492892 |
Solder bump connections |
Timothy H. Daubenspeck, Jeffrey P. Gambino, Ekta Misra, Christopher D. Muzzy, Wolfgang Sauter |
2013-07-23 |
| 8446006 |
Structures and methods to reduce maximum current density in a solder ball |
Raschid J. Bezama, Timothy H. Daubenspeck, Gary LaFontant, Ian D. Melville, Ekta Misra +6 more |
2013-05-21 |
| 8298929 |
Offset solder vias, methods of manufacturing and design structures |
Timothy H. Daubenspeck, Gary LaFontant, Ekta Misra, David L. Questad, Krystyna W. Semkow +3 more |
2012-10-30 |
