Issued Patents All Time
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12122223 | Vehicle | Thomas Liepold | 2024-10-22 |
| 7030044 | Method of forming a cap layer having anti-reflective characteristics on top of a low-k dielectric | Hartmut Ruelke, Joerg Hohage, Thomas Werner | 2006-04-18 |
| 6958247 | Method of electroplating copper over a patterned dielectric layer to enhance process uniformity of a subsequent CMP process | Gerd Marxsen, Axel Preusse, Markus Nopper | 2005-10-25 |
| 6809032 | Method and apparatus for detecting the endpoint of a chemical-mechanical polishing operation using optical techniques | Peter J. Beckage, Paul R. Besser, Frederick N. Hause, Errol Todd Ryan, William S. Brennan +1 more | 2004-10-26 |
| 6555479 | Method for forming openings for conductive interconnects | Frederick N. Hause, Paul R. Besser, Errol Todd Ryan, William S. Brennan, John A. Iacoponi +1 more | 2003-04-29 |
| 6514858 | Test structure for providing depth of polish feedback | Frederick N. Hause, Paul R. Besser, Errol Todd Ryan, William S. Brennan, John A. Iacoponi +1 more | 2003-02-04 |
| 6489240 | Method for forming copper interconnects | John A. Iacoponi, Paul R. Besser, Frederick N. Hause, Errol Todd Ryan, William S. Brennan +1 more | 2002-12-03 |
| 6413846 | Contact each methodology and integration scheme | Paul R. Besser, Errol Todd Ryan, Frederick N. Hause, William S. Brennan, John A. Iacoponi +1 more | 2002-07-02 |