Issued Patents All Time
Showing 1–25 of 104 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12369253 | Circuit and connector element alignment, circuit board assemblies | Danny Clavette | 2025-07-22 |
| 12300874 | Antenna package with via structure and method of formation thereof | Ashutosh Baheti, Saverio Trotta | 2025-05-13 |
| 12272862 | Antenna apparatus and fabrication method | Ashutosh Baheti, Saverio Trotta | 2025-04-08 |
| 12255114 | Embedded package with electrically isolating dielectric liner | — | 2025-03-18 |
| 12014964 | Semiconductor package having an electrically insulating core with exposed glass fibres | Tomasz Naeve, Petteri Palm | 2024-06-18 |
| 11973063 | Semiconductor package with low parasitic connection to passive device | Urban Medic, Tomasz Naeve | 2024-04-30 |
| 11916007 | Semiconductor device with embedded flexible circuit | Ashutosh Baheti, Saverio Trotta | 2024-02-27 |
| 11881437 | Embedded package with electrically isolating dielectric liner | — | 2024-01-23 |
| 11870130 | Antenna apparatus and fabrication method | Ashutosh Baheti, Saverio Trotta | 2024-01-09 |
| 11817617 | Antenna package with via structure and method of formation thereof | Ashutosh Baheti, Saverio Trotta | 2023-11-14 |
| 11776882 | Method of fabricating a semiconductor package | Markus Dinkel, Petteri Palm, Josef Hoeglauer, Ralf Otremba, Fabian Schnoy | 2023-10-03 |
| 11532541 | Semiconductor package having a solderable contact pad formed by a load terminal bond pad of a power semiconductor die | Petteri Palm | 2022-12-20 |
| 11502012 | Semiconductor packages and methods of manufacturing thereof | Tomasz Naeve, Petteri Palm | 2022-11-15 |
| 11469164 | Space efficient and low parasitic half bridge | Robert Fehler, Danny Clavette, Petteri Palm | 2022-10-11 |
| 11302610 | Semiconductor package and method of fabricating a semiconductor package | Markus Dinkel, Petteri Palm, Josef Hoeglauer, Ralf Otremba, Fabian Schnoy | 2022-04-12 |
| 11258162 | Antenna package and method of formation thereof | Ashutosh Baheti, Saverio Trotta | 2022-02-22 |
| 11152321 | Semiconductor device having a copper pillar interconnect structure | Carlo Marbella, Swee Guan Chan, Navas Khan Oratti Kalandar | 2021-10-19 |
| 11101221 | Input/output pins for chip-embedded substrate | Danny Clavette | 2021-08-24 |
| 10818646 | Power stage device with carrier frame for power stage module and integrated inductor | Petteri Palm | 2020-10-27 |
| 10700037 | Reinforcement for electrical connectors | Thorsten Meyer, Xaver Schloegel, Thomas Behrens, Josef Hoeglauer | 2020-06-30 |
| 10692801 | Bond pad and clip configuration for packaged semiconductor device | Chuan Cheah, Jobelito Anjao Guanzon | 2020-06-23 |
| 10681819 | Embedding into printed circuit board with drilling | Danny Clavette, Darryl Galipeau | 2020-06-09 |
| 10666140 | Power converter with at least five electrical connections on a side | — | 2020-05-26 |
| 10573631 | Multi-phase power converter with common connections | — | 2020-02-25 |
| 10490505 | Single-sided power device package | — | 2019-11-26 |