DW

Derick J. Wristers

AM AMD: 151 patents #11 of 9,279Top 1%
Overall (All Time): #6,064 of 4,157,543Top 1%
152
Patents All Time

Issued Patents All Time

Showing 25 most recent of 152 patents

Patent #TitleCo-InventorsDate
7544999 SOI semiconductor device having enhanced, self-aligned dielectric regions in the bulk silicon substrate Andy Wei, Mark B. Fuselier 2009-06-09
7432136 Transistors with controllable threshold voltages, and various methods of making and operating same Mark B. Fuselier, Andy Wei 2008-10-07
7417250 Strained-silicon device with different silicon thicknesses James F. Buller, Qi Xiang, Bin Yu 2008-08-26
7335568 Method of forming doped regions in the bulk substrate of an SOI substrate to control the operational characteristics of transistors formed thereabove, and an integrated circuit device comprising same Andy Wei, Mark B. Fuselier 2008-02-26
7253045 Selective P-channel VT adjustment in SiGe system for leakage optimization David Wu, Hormuzdiar E. Nariman 2007-08-07
7208383 Method of manufacturing a semiconductor component Chad Weintraub, James F. Buller, Jon D. Cheek 2007-04-24
7180136 Biased, triple-well fully depleted SOI structure Andy Wei, Mark B. Fuselier 2007-02-20
7129142 Method of forming doped regions in the bulk substrate of an SOI substrate to control the operational characteristics of transistors formed thereabove, and an integrated circuit device comprising same Andy Wei, Mark B. Fuselier 2006-10-31
6979878 Isolation structure having implanted silicon atoms at the top corner of the isolation trench filling vacancies and interstitial sites Mark I. Gardner, H. Jim Fulford 2005-12-27
6949436 Composite spacer liner for improved transistor performance James F. Buller, David Wu, Scott Luning, Daniel Kadosh 2005-09-27
6936506 Strained-silicon devices with different silicon thicknesses James F. Buller, Qi Xiang, Bin Yu 2005-08-30
6919236 Biased, triple-well fully depleted SOI structure, and various methods of making and operating same Andy Wei, Mark B. Fuselier 2005-07-19
6884702 Method of making an SOI semiconductor device having enhanced, self-aligned dielectric regions in the bulk silicon substrate Andy Wei, Mark B. Fuselier 2005-04-26
6876037 Fully-depleted SOI device Andy Wei, Mark B. Fuselier 2005-04-05
6833307 Method for manufacturing a semiconductor component having an early halo implant Chad Weintraub, James F. Buller, Jon D. Cheek 2004-12-21
6822260 Linewidth measurement structure with embedded scatterometry structure Hormuzdiar E. Nariman 2004-11-23
6812506 Polysilicon linewidth measurement structure with embedded transistor Hormuzdiar E. Nariman 2004-11-02
6801096 Ring oscillator with embedded scatterometry grate array Hormuzdiar E. Nariman, James F. Buller 2004-10-05
6780686 Doping methods for fully-depleted SOI structures, and device comprising the resulting doped regions Andy Wei, Mark B. Fuselier 2004-08-24
6764908 Narrow width CMOS devices fabricated on strained lattice semiconductor substrates with maximized NMOS and PMOS drive currents Daniel Kadosh, Qi Xiang, Bin Yu 2004-07-20
6737332 Semiconductor device formed over a multiple thickness buried oxide layer, and methods of making same Mark B. Fuselier, Andy Wei 2004-05-18
6727534 Electrically programmed MOS transistor source/drain series resistance James F. Buller, Qi Xiang 2004-04-27
6727136 Formation of ultra-shallow depth source/drain extensions for MOS transistors James F. Buller, David Wu, Akif Sultan 2004-04-27
6707106 Semiconductor device with tensile strain silicon introduced by compressive material in a buried oxide layer Qi Xiang, James F. Buller 2004-03-16
6689671 Low temperature solid-phase epitaxy fabrication process for MOS devices built on strained semiconductor substrate Bin Yu 2004-02-10