| 6968288 |
Method for detection of photolithographic defocus |
Dennis L. Macaluso, Richard A. Phelps |
2005-11-22 |
| 6856378 |
Method of photolithographic exposure dose control as a function of resist sensitivity |
Keith J. Machia, Matthew Nicholls, Charles J. Parrish, Craig E. Schneider |
2005-02-15 |
| 6735492 |
Feedback method utilizing lithographic exposure field dimensions to predict process tool overlay settings |
Edward W. Conrad, John S. Smyth, David A. Ziemer |
2004-05-11 |
| 6694498 |
Feed-forward lithographic overlay offset method and system |
Edward W. Conrad, Charles J. Parrish |
2004-02-17 |
| 6674516 |
Method of photolithographic exposure dose control as a function of resist sensitivity |
Keith J. Machia, Matthew Nicholls, Charles J. Parrish, Craig E. Schneider |
2004-01-06 |
| 6606533 |
Method and arrangement for controlling image size of integrated circuits on wafers through post-exposure bake hotplate-specific dose feedback |
— |
2003-08-12 |
| 6518679 |
Capacitive alignment structure and method for chip stacking |
Ning Lu, Wilbur D. Pricer |
2003-02-11 |
| 6412666 |
Fluid container with a keying means to prevent improper fluid loading in a fluid delivery tool and a system including such fluid container and fluid delivery tool |
Dennis P. Hogan, Christopher E. Walsh |
2002-07-02 |
| 6377334 |
Method for controlling image size of integrated circuits on wafers supported on hot plates during post exposure baking of the wafers |
— |
2002-04-23 |
| 6342735 |
Dual use alignment aid |
James J. Colelli, Steven J. Holmes, Peter H. Mitchell, Joseph Mundenar |
2002-01-29 |
| 6278515 |
Method and apparatus for adjusting a tilt of a lithography tool |
Stephen E. Knight |
2001-08-21 |
| 6235439 |
Method for controlling image size of integrated circuits on wafers supported on hot plates during post exposure baking of the wafers |
— |
2001-05-22 |
| 6100506 |
Hot plate with in situ surface temperature adjustment |
James J. Colelli, Randall A. Leggett, Joseph Mundenar |
2000-08-08 |
| 5783309 |
Recovery of an anodically bonded glass device from a substrate by use of a metal interlayer |
Thomas B. Faure, Kurt R. Kimmel, Wilbur D. Pricer |
1998-07-21 |
| 5716763 |
Liquid immersion heating process for substrate temperature uniformity |
Douglas E. Benoit, Harold G. Linde, Denise M. Puisto |
1998-02-10 |
| 5712078 |
High contrast photoresists comprising acid sensitive crosslinked polymeric resins |
Wu-Song Huang, Harold G. Linde |
1998-01-27 |
| 5538151 |
Recovery of an anodically bonded glass device from a susstrate by use of a metal interlayer |
Thomas B. Faure, Kurt R. Kimmel, Wilbur D. Pricer |
1996-07-23 |
