| 12218576 |
Interface for passing control information over an isolation channel |
Michael R. May, Fernando Naim Lavalle Aviles, Carlos Jesus Briseno-Vidrios, Patrick De Bakker, Gabor Marek +3 more |
2025-02-04 |
| 11962233 |
Interface for passing control information over an isolation channel |
Michael R. May, Fernando Naim Lavalle Aviles, Carlos Jesus Briseno-Vidrios, Patrick De Bakker, Gabor Marek +3 more |
2024-04-16 |
| 11575305 |
Interface for passing control information over an isolation channel |
Michael R. May, Fernando Naim Lavalle Aviles, Carlos Jesus Briseno-Vidrios, Patrick De Bakker, Gabor Marek +3 more |
2023-02-07 |
| 10699995 |
Isolator with symmetric multi-channel layout |
Michael R. May, Carlos Jesus Briseno-Vidrios |
2020-06-30 |
| 8552797 |
High accuracy RC calibradion circuit |
— |
2013-10-08 |
| 8023919 |
Receiver dynamically switching to pseudo differential mode for SOC spur reduction |
Burak Kelleci, Halil Kiper, Yuanying Deng |
2011-09-20 |
| 7156726 |
Polishing apparatus and method for forming an integrated circuit |
Feng Chen, Lup San Leong |
2007-01-02 |
| 6964598 |
Polishing apparatus and method for forming an integrated circuit |
Lup San Leong, Feng Chen |
2005-11-15 |
| 6653227 |
Method of cobalt silicidation using an oxide-Titanium interlayer |
Chung Woh Lai, Beichao Zhang, Eng Hua Lim, Arthur Ang, Hai Jiang Peng |
2003-11-25 |
| 6558739 |
Titanium nitride/titanium tungsten alloy composite barrier layer for integrated circuits |
Erzhuang Liu, Yih-Shung Lin |
2003-05-06 |
| 6443809 |
Polishing apparatus and method for forming an integrated circuit |
Lup San Leong, Feng Chen |
2002-09-03 |
| 6376378 |
Polishing apparatus and method for forming an integrated circuit |
Feng Chen, Lup San Leong |
2002-04-23 |
| 6245193 |
Chemical mechanical polishing apparatus improved substrate carrier head and method of use |
Ser Wee Quek, Jimmy Lo Yuk Ting |
2001-06-12 |
| 6211040 |
Two-step, low argon, HDP CVD oxide deposition process |
Huang Liu, John Sudijono, Quah Ya Lin |
2001-04-03 |
| 6207554 |
Gap filling process in integrated circuits using low dielectric constant materials |
Yi Xu, Jia Zhen Zheng, Jane Hui, Yih-Shung Lin |
2001-03-27 |
| 6183189 |
Self aligning wafer chuck design for wafer processing tools |
Erzhuang Lzu, Xiaosong Eric Tang, Yih-Shung Lin |
2001-02-06 |
| 6136710 |
Chemical mechanical polishing apparatus with improved substrate carrier head and method of use |
Ser Wee Quek, Jimmy Lo(Yuk Ting) |
2000-10-24 |
| 6054390 |
Grazing incident angle processing method for microelectronics layer fabrication |
Erzhuang Liu, Yih-Shung Lin |
2000-04-25 |
| 5918152 |
Gap filling method using high pressure |
Liu Erzhuang, Yih-Shung Lin |
1999-06-29 |