Issued Patents All Time
Showing 25 most recent of 33 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12113087 | Image sensor package | Ji Hwang Kim, Jong Bo Shim, Sang-Uk Han, Won-Il Lee | 2024-10-08 |
| 11637140 | Image sensor package | Ji Hwang Kim, Jong Bo Shim, Sang-Uk Han, Won-Il Lee | 2023-04-25 |
| 11610865 | Semiconductor package | Sun-kyoung Seo, Soo Hyun Ha | 2023-03-21 |
| 11244936 | Semiconductor device package and apparatus comprising the same | Yun-Hyeok Im, Hee-Seok Lee, Taek Kyun Shin | 2022-02-08 |
| 11018026 | Interposer, semiconductor package, and method of fabricating interposer | Un-Byoung Kang, Tae-Je Cho, Hyuek Jae Lee | 2021-05-25 |
| 10991677 | Semiconductor package | Sun-kyoung Seo, Soo Hyun Ha | 2021-04-27 |
| 10971535 | Image sensor package | Ji Hwang Kim, Jong Bo Shim, Sang-Uk Han, Won-Il Lee | 2021-04-06 |
| 10867970 | Semiconductor package | Sun-kyoung Seo, Soo Hyun Ha | 2020-12-15 |
| 10750112 | Substrate structures for image sensor modules and image sensor modules including the same | Ji Hwang Kim, Hyo-Eun Kim, Jong Bo Shim, Sang-Uk Han | 2020-08-18 |
| 10680025 | Semiconductor package and image sensor | Jong Bo Shim, Sang-Uk Han | 2020-06-09 |
| 10658341 | Semiconductor package | Sun-kyoung Seo, Soo Hyun Ha | 2020-05-19 |
| 10535534 | Method of fabricating an interposer | Un-Byoung Kang, Tae-Je Cho, Hyuek Jae Lee | 2020-01-14 |
| 10483150 | Apparatus for stacking semiconductor chips in a semiconductor package | Gun Lee, Ji Hwan Hwang, Dong-Han Kim, Seung-Kon Mok | 2019-11-19 |
| 10373935 | Semiconductor package | Sun-kyoung Seo, Soo Hyun Ha | 2019-08-06 |
| 10224272 | Semiconductor package including a rewiring layer with an embedded chip | Ji Hwang Kim, Jong Bo Shim, Won-Il Lee | 2019-03-05 |
| 10141286 | Methods of manufacturing semiconductor packages | Won-Il Lee, Ji Hwang Kim | 2018-11-27 |
| 10134702 | Semiconductor chip, semiconductor package including the same, and method of manufacturing semiconductor chip | Sun-kyoung Seo, Seung-Kwan Ryu, Tae-Je Cho | 2018-11-20 |
| 10083939 | Semiconductor package | Sun-kyoung Seo, Soo Hyun Ha | 2018-09-25 |
| 10026724 | Semiconductor package and method of manufacturing the same | Ji Hwang Kim, Jong Bo Shim, Sang-Uk Han, Gun-ho Chang | 2018-07-17 |
| 9997446 | Semiconductor package including a rewiring layer with an embedded chip | Ji Hwang Kim, Jong Bo Shim, Won-Il Lee | 2018-06-12 |
| 9728424 | Method of fabricating a packaged integrated circuit with through-silicon via an inner substrate | Ji Hwang Kim, Un-Byoung Kang, Tae-Je Cho | 2017-08-08 |
| 9666551 | Semiconductor chip, semiconductor package including the same, and method of manufacturing semiconductor chip | Sun-kyoung Seo, Seung-Kwan Ryu, Tae-Je Cho | 2017-05-30 |
| 9618716 | Photonic integrated circuit | Sang Cheon Park, Tae-Je Cho | 2017-04-11 |
| 9589945 | Semiconductor package having stacked semiconductor chips | Yun-Hyeok Im, Tae-Je Cho | 2017-03-07 |
| 9543231 | Stacked semiconductor package | Yun-Seok Choi, Hyeok-man Kwon, Tae-Je Cho | 2017-01-10 |