| 12237249 |
Substrates with solder barriers on leads |
Madison Paige Koziol |
2025-02-25 |
| 12154845 |
Semiconductor package with nickel-silver pre-plated leadframe |
Nazila Dadvand |
2024-11-26 |
| 11930590 |
Stress relief for flip-chip packaged devices |
Tianyi Luo, Osvaldo Jorge Lopez, Jonathan Almeria Noquil, Satyendra Singh Chauhan |
2024-03-12 |
| 11848258 |
Semiconductor package with nickel-silver pre-plated leadframe |
Nazila Dadvand |
2023-12-19 |
| 11244881 |
Package terminal cavities |
— |
2022-02-08 |
| 10672692 |
Leadframe having organic, polymerizable photo-imageable adhesion layer |
Jaimal Mallory Williamson, Jose Carlos Arroyo |
2020-06-02 |
| 9934989 |
Process for forming leadframe having organic, polymerizable photo-imageable adhesion layer |
Jaimal Mallory Williamson, Jose Carlos Arroyo |
2018-04-03 |
| 9875930 |
Method of packaging a circuit |
Abram Castro |
2018-01-23 |
| 9536781 |
Method of making integrated circuit |
Abram Castro |
2017-01-03 |
| 9373572 |
Semiconductor package having etched foil capacitor integrated into leadframe |
Gregory E. Howard, Rajiv Dunne, Darvin R. Edwards, Siva Prakash Gurrum, Manu J. Prakuzhy +1 more |
2016-06-21 |
| 9165873 |
Semiconductor package having etched foil capacitor integrated into leadframe |
Gregory E. Howard, Rajiv Dunne, Darvin R. Edwards, Siva Prakash Gurrum, Manu J. Prakuzhy +1 more |
2015-10-20 |
| 9142472 |
Integrated circuit and method of making |
Abram Castro |
2015-09-22 |
| 9142496 |
Semiconductor package having etched foil capacitor integrated into leadframe |
Gregory E. Howard, Rajiv Dunne, Darvin R. Edwards, Siva Prakash Gurrum, Manu J. Prakuzhy +1 more |
2015-09-22 |
| 9054092 |
Method and apparatus for stopping resin bleed and mold flash on integrated circuit lead finishes |
Yong Lin |
2015-06-09 |
| 8298874 |
Packaged electronic devices having die attach regions with selective thin dielectric layer |
Kenji Masumoto |
2012-10-30 |
| 8222748 |
Packaged electronic devices having die attach regions with selective thin dielectric layer |
Kenji Masumoto |
2012-07-17 |
| 7939939 |
Stable gold bump solder connections |
Kejun Zeng, Wei Qun Peng, Rebecca L. Holford, Robert John Furtaw |
2011-05-10 |
| 7851928 |
Semiconductor device having substrate with differentially plated copper and selective solder |
Donald C. Abbott |
2010-12-14 |
| 7808113 |
Flip chip semiconductor device having workpiece adhesion promoter layer for improved underfill adhesion |
— |
2010-10-05 |