Issued Patents All Time
Showing 25 most recent of 35 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12261063 | Method and device for producing a housing | — | 2025-03-25 |
| 12211824 | Power semiconductor package having first and second lead frames | Ivan Nikitin, Thorsten Scharf, Marco Bäßler, Waldemar Jakobi | 2025-01-28 |
| 12165959 | Leadframe, encapsulated package with punched lead and sawn side flanks, and corresponding manufacturing method | Frank Singer, Marcus Boehm, Martin Gruber, Uwe Schindler | 2024-12-10 |
| 11973012 | Power module with semiconductor packages mounted on metal frame | — | 2024-04-30 |
| 11908760 | Package with encapsulated electronic component between laminate and thermally conductive carrier | — | 2024-02-20 |
| 11862533 | Fluid-cooled package having shielding layer | Wolfram Hable, Juergen Hoegerl, Ivan Nikitin, Achim Strass | 2024-01-02 |
| 11626351 | Semiconductor package with barrier to contain thermal interface material | Ivan Nikitin, Timo Bohnenberger, Martin Mayer, Alexander Roth, Franz Zollner | 2023-04-11 |
| 11598904 | Power semiconductor module and method for producing a power semiconductor module | Ivan Nikitin, Dirk Ahlers, Andre Uhlemann | 2023-03-07 |
| 11574889 | Power module comprising two substrates and method of manufacturing the same | Ottmar Geitner, Wolfram Hable, Frank Winter, Christian Neugirg, Ivan Nikitin | 2023-02-07 |
| 11264356 | Batch manufacture of packages by sheet separated into carriers after mounting of electronic components | Thorsten Meyer, Thomas Behrens, Martin Gruber, Thorsten Scharf | 2022-03-01 |
| 11244886 | Package cooled with cooling fluid and comprising shielding layer | Wolfram Hable, Juergen Hoegerl, Ivan Nikitin, Achim Strass | 2022-02-08 |
| 11171066 | Semiconductor panels, semiconductor packages, and methods for manufacturing thereof | Thorsten Meyer | 2021-11-09 |
| 11056458 | Package comprising chip contact element of two different electrically conductive materials | Angela Kessler | 2021-07-06 |
| 10615097 | Chip carrier with electrically conductive layer extending beyond thermally conductive dielectric sheet | Wolfram Hable, Juergen Hoegerl, Angela Kessler, Ivan Nikitin, Achim Strass | 2020-04-07 |
| 10586756 | Chip carrier configured for delamination-free encapsulation and stable sintering | Alexander Roth, Juergen Hoegerl, Angela Kessler | 2020-03-10 |
| 10461017 | Package with partially encapsulated cooling channel for cooling an encapsulated chip | Wolfram Hable, Juergen Hoegerl, Ivan Nikitin, Achim Strass | 2019-10-29 |
| 10453771 | Package with roughened encapsulated surface for promoting adhesion | Juergen Hoegerl, Kiyoung Jang, Ivan Nikitin | 2019-10-22 |
| 10373890 | Cooling techniques for semiconductor package | Juergen Hoegerl | 2019-08-06 |
| 10304751 | Electronic sub-module including a leadframe and a semiconductor chip disposed on the leadframe | Juergen Hoegerl | 2019-05-28 |
| 10211133 | Package with interconnections having different melting temperatures | Juergen Hoegerl, Angela Kessler, Ivan Nikitin | 2019-02-19 |
| 10199238 | Semiconductor module cooling system | Inpil Yoo | 2019-02-05 |
| 10128165 | Package with vertically spaced partially encapsulated contact structures | Wolfram Hable, Juergen Hoegerl, Eduard Knauer, Michael Ledutke | 2018-11-13 |
| 9934990 | Method of manufacturing a cooler for semiconductor modules | Inpil Yoo | 2018-04-03 |
| 9768766 | Electronic switching element and integrated sensor | Stefan Willkofer, Gernot Langguth, Wolfgang Roesner | 2017-09-19 |
| 9721863 | Printed circuit board including a leadframe with inserted packaged semiconductor chips | Juergen Hoegerl | 2017-08-01 |