Issued Patents All Time
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10147876 | Phase change memory electrode with multiple thermal interfaces | Lidu Huang, Mac D. Apodaca, Toshiki Hirano, Guy Wicker, Federico Nardi | 2018-12-04 |
| 9330965 | Double self aligned via patterning | Hsueh-Chung Chen, Yongan Xu, Yunpeng Yin | 2016-05-03 |
| 9257334 | Double self-aligned via patterning | Hsueh-Chung Chen, Yongan Xu, Yunpeng Yin | 2016-02-09 |
| 9219007 | Double self aligned via patterning | Hsueh-Chung Chen, Yongan Xu, Yunpeng Yin | 2015-12-22 |
| 9054052 | Methods for integration of pore stuffing material | Nicholas V. LiCausi, Errol Todd Ryan, Ming He, Moosung Chae, Kunaljeet Tanwar +4 more | 2015-06-09 |
| 8932934 | Methods of self-forming barrier integration with pore stuffed ULK material | Moosung Chae, Errol Todd Ryan, Nicholas V. LiCausi, Christian Witt, Ming He +3 more | 2015-01-13 |
| 8455298 | Method for forming self-aligned phase-change semiconductor diode memory | Mac D. Apodaca, Jenn C. Chow, Thomas Brown, Lisa Ceder | 2013-06-04 |
| 6555396 | Method and apparatus for enhancing endpoint detection of a via etch | John A. Iacoponi, Thomas E. Spikes, Jr. | 2003-04-29 |