Issued Patents All Time
Showing 26–50 of 114 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10483248 | Wafer level chip scale filter packaging using semiconductor wafers with through wafer vias | Jiro Yota, Viswanathan Ramanathan | 2019-11-19 |
| 10446456 | Integrated circuits protected by substrates with cavities, and methods of manufacture | Charles G. Woychik, Arkalgud R. Sitaram | 2019-10-15 |
| 10431648 | Making electrical components in handle wafers of integrated circuit packages | Liang Wang, Rajesh Katkar | 2019-10-01 |
| 10350522 | Truncated filter capsule | ZhenWu Lin | 2019-07-16 |
| 10340186 | Method for reducing cross contamination in integrated circuit manufacturing | — | 2019-07-02 |
| 10256177 | Integrated interposer solutions for 2D and 3D IC packaging | Charles G. Woychik, Arkalgud R. Sitaram, Guilian Gao | 2019-04-09 |
| 10204977 | Making electrical components in handle wafers of integrated circuit packages | Liang Wang, Rajesh Katkar | 2019-02-12 |
| 10178363 | HD color imaging using monochromatic CMOS image sensors integrated in 3D package | Liang Wang, Guilian Gao, Arkalgud R. Sitaram | 2019-01-08 |
| 10177086 | Microelectronic components with features wrapping around protrusions of conductive vias protruding from through-holes passing through substrates | Cyprian Emeka Uzoh, Charles G. Woychik, Arkalgud R. Sitaram, Zhuowen Sun, Liang Wang +1 more | 2019-01-08 |
| 10163833 | Multichip modules and methods of fabrication | Liang Wang, Rajesh Katkar | 2018-12-25 |
| 10014243 | Interconnection substrates for interconnection between circuit modules, and methods of manufacture | Liang Wang, Gabriel Z. Guevara, Rajesh Katkar, Cyprian Emeka Uzoh, Laura Wills Mirkarimi | 2018-07-03 |
| 9947618 | Microelectronic components with features wrapping around protrusions of conductive vias protruding from through-holes passing through substrates | Cyprian Emeka Uzoh, Charles G. Woychik, Arkalgud R. Sitaram, Zhuowen Sun, Liang Wang +1 more | 2018-04-17 |
| 9946712 | Techniques for user identification of and translation of media | — | 2018-04-17 |
| 9905507 | Circuit assemblies with multiple interposer substrates, and methods of fabrication | Zhuowen Sun, Charles G. Woychik, Arkalgud R. Sitaram | 2018-02-27 |
| 9905523 | Microelectronic assemblies formed using metal silicide, and methods of fabrication | Liang Wang, Arkalgud R. Sitaram | 2018-02-27 |
| 9899281 | Integrated circuits protected by substrates with cavities, and methods of manufacture | Charles G. Woychik, Arkalgud R. Sitaram | 2018-02-20 |
| 9888584 | Contact structures with porous networks for solder connections, and methods of fabricating same | Liang Wang, Rajesh Katkar, Cyprian Emeka Uzoh | 2018-02-06 |
| 9865675 | Making multilayer 3D capacitors using arrays of upstanding rods or ridges | Liang Wang, Rajesh Katkar, Cyprian Emeka Uzoh | 2018-01-09 |
| 9859234 | Methods and structures to repair device warpage | Cyprian Emeka Uzoh, Guilian Gao, Bongsub Lee, Scott McGrath, Charles G. Woychik +2 more | 2018-01-02 |
| 9831302 | Making electrical components in handle wafers of integrated circuit packages | Liang Wang, Rajesh Katkar | 2017-11-28 |
| 9825002 | Flipped die stack | Rajesh Katkar, Reynaldo Co, Scott McGrath, Ashok S. Prabhu, Sangil Lee +1 more | 2017-11-21 |
| 9824974 | Integrated circuit assemblies with rigid layers used for protection against mechanical thinning and for other purposes, and methods of fabricating such assemblies | Guilian Gao, Cyprian Emeka Uzoh, Charles G. Woychik, Arkalgud R. Sitaram, Liang Wang +2 more | 2017-11-21 |
| 9812406 | Microelectronic assemblies with cavities, and methods of fabrication | Liang Wang, Rajesh Katkar, Charles G. Woychik, Guilian Gao | 2017-11-07 |
| 9755592 | Power amplifier modules including tantalum nitride terminated through wafer via and related systems, devices, and methods | Peter J. Zampardi, Jr., Hsiang-Chih Sun, Mehran Janani, Jens Albrecht Riege | 2017-09-05 |
| 9754866 | Reversed build-up substrate for 2.5D | Liang Wang, Rajesh Katkar, Cyprian Emeka Uzoh, Belgacem Haba | 2017-09-05 |