Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11335669 | Wafer level chip scale filter packaging using semiconductor wafers with through wafer vias | Jiro Yota, Hong Shen | 2022-05-17 |
| 11101160 | Device packaging using a recyclable carrier substrate | Jiro Yota, Hong Shen | 2021-08-24 |
| 10629468 | Device packaging using a recyclable carrier substrate | Jiro Yota, Hong Shen | 2020-04-21 |
| 10483248 | Wafer level chip scale filter packaging using semiconductor wafers with through wafer vias | Jiro Yota, Hong Shen | 2019-11-19 |
| 9735249 | Gate structure with refractory metal barrier | Shiban K. Tiku | 2017-08-15 |
| 9422621 | Refractory metal barrier in semiconductor devices | Shiban K. Tiku | 2016-08-23 |