Issued Patents All Time
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12406944 | Moisture barrier for metal insulator metal capacitors and integrated circuit having the same | Shiban K. Tiku | 2025-09-02 |
| 11830826 | Moisture barrier for bond pads and integrated circuit having the same | Shiban K. Tiku | 2023-11-28 |
| 11804460 | Devices and methods related to stack structures including passivation layers for distributing compressive force | Dogan Gunes | 2023-10-31 |
| 11387193 | Method of making moisture barrier for bond pads and integrated circuit having the same | Shiban K. Tiku | 2022-07-12 |
| 11335669 | Wafer level chip scale filter packaging using semiconductor wafers with through wafer vias | Hong Shen, Viswanathan Ramanathan | 2022-05-17 |
| 11257774 | Stack structures in electronic devices including passivation layers for distributing compressive force | Dogan Gunes | 2022-02-22 |
| 11222855 | Moisture barrier for bond pads and integrated circuit having the same | Shiban K. Tiku | 2022-01-11 |
| 11101160 | Device packaging using a recyclable carrier substrate | Hong Shen, Viswanathan Ramanathan | 2021-08-24 |
| 10629468 | Device packaging using a recyclable carrier substrate | Hong Shen, Viswanathan Ramanathan | 2020-04-21 |
| 10483248 | Wafer level chip scale filter packaging using semiconductor wafers with through wafer vias | Hong Shen, Viswanathan Ramanathan | 2019-11-19 |