Issued Patents All Time
Showing 51–75 of 114 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9741649 | Integrated interposer solutions for 2D and 3D IC packaging | Charles G. Woychik, Arkalgud R. Sitaram, Guilian Gao | 2017-08-22 |
| 9741620 | Structures and methods for reliable packages | Cyprian Emeka Uzoh, Guilian Gao, Liang Wang, Arkalgud R. Sitaram | 2017-08-22 |
| 9691702 | Microelectronic components with features wrapping around protrusions of conductive vias protruding from through-holes passing through substrates | Cyprian Emeka Uzoh, Charles G. Woychik, Arkalgud R. Sitaram, Zhuowen Sun, Liang Wang +1 more | 2017-06-27 |
| 9691696 | Interposers with circuit modules encapsulated by moldable material in a cavity, and methods of fabrication | Liang Wang, Rajesh Katkar | 2017-06-27 |
| 9666559 | Multichip modules and methods of fabrication | Liang Wang, Rajesh Katkar | 2017-05-30 |
| 9666560 | Multi-chip microelectronic assembly with built-up fine-patterned circuit structure | Liang Wang, Guilian Gao, Rajesh Katkar, Belgacem Haba | 2017-05-30 |
| 9666508 | Gallium arsenide devices with copper backside for direct die solder attach | — | 2017-05-30 |
| 9583426 | Multi-layer substrates suitable for interconnection between circuit modules | Liang Wang, Gabriel Z. Guevara, Rajesh Katkar, Cyprian Emeka Uzoh, Laura Wills Mirkarimi | 2017-02-28 |
| 9548273 | Integrated circuit assemblies with rigid layers used for protection against mechanical thinning and for other purposes, and methods of fabricating such assemblies | Guilian Gao, Cyprian Emeka Uzoh, Charles G. Woychik, Arkalgud R. Sitaram, Liang Wang +2 more | 2017-01-17 |
| 9536862 | Microelectronic assemblies with integrated circuits and interposers with cavities, and methods of manufacture | Charles G. Woychik, Arkalgud R. Sitaram | 2017-01-03 |
| 9530719 | Direct die solder of gallium arsenide integrated circuit dies and methods of manufacturing gallium arsenide wafers | — | 2016-12-27 |
| 9508638 | Making electrical components in handle wafers of integrated circuit packages | Liang Wang, Rajesh Katkar | 2016-11-29 |
| 9502347 | Microelectronic assemblies formed using metal silicide, and methods of fabrication | Liang Wang, Arkalgud R. Sitaram | 2016-11-22 |
| 9478504 | Microelectronic assemblies with cavities, and methods of fabrication | Liang Wang, Rajesh Katkar, Charles G. Woychik, Guilian Gao | 2016-10-25 |
| 9437536 | Reversed build-up substrate for 2.5D | Liang Wang, Rajesh Katkar, Cyprian Emeka Uzoh, Belgacem Haba | 2016-09-06 |
| 9412806 | Making multilayer 3D capacitors using arrays of upstanding rods or ridges | Liang Wang, Rajesh Katkar, Cyprian Emeka Uzoh | 2016-08-09 |
| 9402312 | Circuit assemblies with multiple interposer substrates, and methods of fabrication | Zhuowen Sun, Charles G. Woychik, Arkalgud R. Sitaram | 2016-07-26 |
| 9397038 | Microelectronic components with features wrapping around protrusions of conductive vias protruding from through-holes passing through substrates | Cyprian Emeka Uzoh, Charles G. Woychik, Arkalgud R. Sitaram, Zhuowen Sun, Liang Wang +1 more | 2016-07-19 |
| 9373181 | System and method for enhanced viewing of rib metastasis | Shuping Qing | 2016-06-21 |
| 9324626 | Interposers with circuit modules encapsulated by moldable material in a cavity, and methods of fabrication | Liang Wang, Rajesh Katkar | 2016-04-26 |
| 9252127 | Microelectronic assemblies with integrated circuits and interposers with cavities, and methods of manufacture | Charles G. Woychik, Arkalgud R. Sitaram | 2016-02-02 |
| 9231068 | Methods of stress balancing in gallium arsenide wafer processing | — | 2016-01-05 |
| 9165793 | Making electrical components in handle wafers of integrated circuit packages | Liang Wang, Rajesh Katkar | 2015-10-20 |
| 9093506 | Process for fabricating gallium arsenide devices with copper contact layer | — | 2015-07-28 |
| 9041472 | Power amplifier modules including related systems, devices, and methods | Howard E. Chen, Yifan Guo, Dinhphuoc Vu Hoang, Mehran Janani, Tin Myint Ko +15 more | 2015-05-26 |