Issued Patents All Time
Showing 51–75 of 88 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8603858 | Method for manufacturing a semiconductor package | Paul Ganitzer | 2013-12-10 |
| 8466546 | Chip-scale package | Andy Farlow, Mark Pavier, Andrew N. Sawle, George Pearson | 2013-06-18 |
| 8368211 | Solderable top metalization and passivation for source mounted package | Andrew N. Sawle, Matthew P. Elwin, David Paul Jones, Martin Carroll, Ian Glenville Wagstaffe | 2013-02-05 |
| 8368223 | Paste for forming an interconnect and interconnect formed from the paste | — | 2013-02-05 |
| 8319334 | Embedded laminated device | — | 2012-11-27 |
| 8264073 | Multi-phase voltage regulation module | — | 2012-09-11 |
| 8125083 | Protective barrier layer for semiconductor device electrodes | Martin Carroll, David Paul Jones, Andrew N. Sawle | 2012-02-28 |
| 8097938 | Conductive chip-scale package | Robert J. Clarke | 2012-01-17 |
| 8083832 | Paste for forming an interconnect and interconnect formed from the paste | — | 2011-12-27 |
| 8061023 | Process of fabricating a semiconductor package | — | 2011-11-22 |
| 7968984 | Universal pad arrangement for surface mounted semiconductor devices | Andrew N. Sawle | 2011-06-28 |
| 7592688 | Semiconductor package | — | 2009-09-22 |
| 7524701 | Chip-scale package | Robert J. Clarke | 2009-04-28 |
| 7482681 | Semiconductor device package utilizing proud interconnect material | — | 2009-01-27 |
| 7476964 | High voltage semiconductor device housing with increased clearance between housing can and die for improved flux flushing | — | 2009-01-13 |
| 7476979 | Chip scale surface mounted device and process of manufacture | Hazel Schofield | 2009-01-13 |
| 7466012 | Power semiconductor package | Robert J. Clarke | 2008-12-16 |
| 7402507 | Semiconductor package fabrication | Mark Pavier, Robert J. Clarke, Andrew N. Sawle, Kenneth McCartney | 2008-07-22 |
| 7368325 | Semiconductor package | — | 2008-05-06 |
| 7364949 | Semiconductor device package | — | 2008-04-29 |
| 7315081 | Semiconductor device package utilizing proud interconnect material | — | 2008-01-01 |
| 7285866 | Surface mounted package with die bottom spaced from support board | Andrew N. Sawle | 2007-10-23 |
| 7253090 | Chip scale surface mounted device and process of manufacture | Hazel Schofield | 2007-08-07 |
| 7230333 | Semiconductor package | — | 2007-06-12 |
| 7122887 | Chip scale surface mounted device and process of manufacture | Hazel Schofield | 2006-10-17 |