Issued Patents All Time
Showing 26–50 of 88 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9653370 | Systems and methods for embedding devices in printed circuit board structures | Andrew Roberts | 2017-05-16 |
| 9642289 | Power supply and method | — | 2017-05-02 |
| 9633951 | Semiconductor package including a semiconductor die having redistributed pads | Mark Pavier, Andrew N. Sawle | 2017-04-25 |
| 9620471 | Power semiconductor package with conductive clips | Robert J. Clarke | 2017-04-11 |
| 9595512 | Passive component integrated with semiconductor device in semiconductor package | — | 2017-03-14 |
| 9559047 | Passive component as thermal capacitance and heat sink | Milko Paolucci | 2017-01-31 |
| 9559056 | Electronic component | — | 2017-01-31 |
| 9496205 | Power semiconductor package | — | 2016-11-15 |
| 9496245 | Semiconductor package with integrated semiconductor devices and passive component | — | 2016-11-15 |
| 9472541 | Methods for manufacturing an electronic module | Johannes Schoiswohl | 2016-10-18 |
| 9418925 | Electronic component and method for electrically coupling a semiconductor die to a contact pad | Marcus Pawley | 2016-08-16 |
| 9391004 | Power semiconductor package with conductive clip and related method | — | 2016-07-12 |
| 9391003 | Semiconductor package with conductive clip | — | 2016-07-12 |
| 9281260 | Semiconductor packages and methods of forming the same | Andrew Roberts | 2016-03-08 |
| 9147644 | Semiconductor device and passive component integration in a semiconductor package | — | 2015-09-29 |
| 9084382 | Method of embedding an electronic component into an aperture of a substrate | — | 2015-07-14 |
| 9070642 | Electronic module | Johannes Schoiswohl | 2015-06-30 |
| 9054090 | Power semiconductor package | — | 2015-06-09 |
| 9048196 | Power semiconductor package | Robert J. Clarke | 2015-06-02 |
| 9041191 | Power semiconductor package | — | 2015-05-26 |
| 9041187 | Power semiconductor package with multiple dies | — | 2015-05-26 |
| 8970032 | Chip module and method for fabricating a chip module | Ralf Otremba, Josef Hoeglauer | 2015-03-03 |
| 8786072 | Semiconductor package | — | 2014-07-22 |
| 8759156 | Method of producing laminated device | — | 2014-06-24 |
| 8686554 | Vertically mountable semiconductor device package | — | 2014-04-01 |