Issued Patents All Time
Showing 1–25 of 88 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12199046 | Electrical devices and methods of manufacture | Parviz Parto | 2025-01-14 |
| 11621230 | Electrical devices and methods of manufacture | Parviz Parto | 2023-04-04 |
| 11069624 | Electrical devices and methods of manufacture | Parviz Parto | 2021-07-20 |
| 10553557 | Electronic component, system and method | Marcus Pawley, Andrew Roberts, Robert J. Clarke | 2020-02-04 |
| 10361178 | Interconnection structure, LED module and method | — | 2019-07-23 |
| 10257937 | Device for electrically coupling a plurality of semiconductor device layers by a common conductive layer | Andrew Roberts | 2019-04-09 |
| 10249551 | Electronic component having a heat-sink thermally coupled to a heat-spreader | — | 2019-04-02 |
| 10192846 | Method of inserting an electronic component into a slot in a circuit board | Marcus Pawley, Andrew Roberts, Robert J. Clarke | 2019-01-29 |
| 10103076 | Semiconductor package including a semiconductor die having redistributed pads | Mark Pavier, Andrew N. Sawle | 2018-10-16 |
| 10074616 | Chip protection envelope and method | — | 2018-09-11 |
| 10064287 | System and method of providing a semiconductor carrier and redistribution structure | Andrew Roberts | 2018-08-28 |
| 10032688 | Electronic component and method for dissipating heat from a semiconductor die | Marcus Pawley | 2018-07-24 |
| 9978719 | Electronic component, arrangement and method | — | 2018-05-22 |
| 9974187 | Power in lead | Andrew Roberts, Milko Paolucci | 2018-05-15 |
| 9917024 | Electronic component and method for electrically coupling a semiconductor die to a contact pad | Marcus Pawley | 2018-03-13 |
| 9867277 | High performance vertical interconnection | Andrew Roberts | 2018-01-09 |
| 9852940 | Method for forming a reliable solderable contact | Andrew N. Sawle, Matthew P. Elwin, David Paul Jones, Martin Carroll, Ian Glenville Wagstaffe | 2017-12-26 |
| 9852939 | Solderable contact and passivation for semiconductor dies | Andrew N. Sawle, Matthew P. Elwin, David Paul Jones, Martin Carroll, Ian Glenville Wagstaffe | 2017-12-26 |
| 9837393 | Semiconductor package with integrated semiconductor devices and passive component | — | 2017-12-05 |
| 9831147 | Packaged semiconductor device with internal electrical connections to outer contacts | — | 2017-11-28 |
| 9824977 | Semiconductor packages and methods of forming the same | Andrew Roberts | 2017-11-21 |
| 9799623 | Semiconductor package with conductive clip | — | 2017-10-24 |
| 9769928 | High efficiency embedding technology | — | 2017-09-19 |
| 9741635 | Electronic component | — | 2017-08-22 |
| 9653370 | Systems and methods for embedding devices in printed circuit board structures | Andrew Roberts | 2017-05-16 |