Issued Patents All Time
Showing 76–88 of 88 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7088004 | Flip-chip device having conductive connectors | — | 2006-08-08 |
| 7045884 | Semiconductor device package | — | 2006-05-16 |
| 6967412 | Wafer level underfill and interconnect process | — | 2005-11-22 |
| 6930397 | Surface mounted package with die bottom spaced from support board | Andrew N. Sawle | 2005-08-16 |
| 6890845 | Chip scale surface mounted device and process of manufacture | Hazel Schofield | 2005-05-10 |
| D503691 | Conductive clip for a semiconductor package | Hazel Schofield | 2005-04-05 |
| D502151 | Semiconductor package | — | 2005-02-22 |
| 6841865 | Semiconductor device having clips for connecting to external elements | — | 2005-01-11 |
| 6767820 | Chip scale surface mounted device and process of manufacture | Hazel Schofield | 2004-07-27 |
| 6677669 | Semiconductor package including two semiconductor die disposed within a common clip | — | 2004-01-13 |
| 6624522 | Chip scale surface mounted device and process of manufacture | Hazel Schofield | 2003-09-23 |
| 6582990 | Wafer level underfill and interconnect process | — | 2003-06-24 |
| 6573122 | Wafer level insulation underfill for die attach | — | 2003-06-03 |