Issued Patents All Time
Showing 151–161 of 161 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7282404 | Inexpensive method of fabricating a higher performance capacitance density MIMcap integrable into a copper interconnect scheme | Douglas D. Coolbaugh, Ebenezer E. Eshun, William J. Murphy, Vidhya Ramachandran | 2007-10-16 |
| 7271693 | On-chip inductor with magnetic core | Hanyi Ding, Kai D. Feng, Xuefeng Liu | 2007-09-18 |
| 7245025 | Low cost bonding pad and method of fabricating same | Jeffrey A. Brigante, Barbara Waterhouse, Eric J. White | 2007-07-17 |
| 7170181 | Optimum padset for wire bonding RF technologies with high-Q inductors | Douglas D. Coolbaugh, Wolfgang Sauter, Barbara Waterhouse | 2007-01-30 |
| 7129561 | Tri-metal and dual-metal stacked inductors | Douglas D. Coolbaugh, Daniel C. Edelstein, Robert A. Groves | 2006-10-31 |
| 7071530 | Multiple layer structure for substrate noise isolation | Hanyi Ding, Kai D. Feng, Xuefeng Liu | 2006-07-04 |
| 7061359 | On-chip inductor with magnetic core | Hanyi Ding, Kai D. Feng, Xuefeng Liu | 2006-06-13 |
| 6913965 | Non-Continuous encapsulation layer for MIM capacitor | Wagdi W. Abadeer, Eric Adler, Bradley A. Orner, Vidhya Ramachandran, Barbara Waterhouse +1 more | 2005-07-05 |
| 6876028 | Metal-insulator-metal capacitor and method of fabrication | Douglas D. Coolbaugh, Ebenezer E. Eshun, Jeffrey P. Gambino, Vidhya Ramachandran | 2005-04-05 |
| 6559030 | Method of forming a recessed polysilicon filled trench | Thai Doan, Michael P. McMahon | 2003-05-06 |
| 6387810 | Method for homogenizing device parameters through photoresist planarization | Gary J. Beardsley, Cuc K. Huynh, Michael P. McMahon | 2002-05-14 |