Issued Patents All Time
Showing 51–75 of 172 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10274651 | Manufacturing three-dimensional diffraction gratings by selective deposition or selective etching | Nihar Mohanty, Giuseppe Calafiore, Austin Lane, Matthieu Charles Raoul Leibovici | 2019-04-30 |
| 10121661 | Self aligned pattern formation post spacer etchback in tight pitch configurations | Sean D. Burns, Lawrence A. Clevenger, Nelson Felix, Sivananda K. Kanakasabapathy, Christopher J. Penny +2 more | 2018-11-06 |
| 10083864 | Self aligned conductive lines with relaxed overlay | Sean D. Burns, Lawrence A. Clevenger, Sivananda K. Kanakasabapathy, Yann Mignot, Christopher J. Penny +2 more | 2018-09-25 |
| 9991156 | Self-aligned quadruple patterning (SAQP) for routing layouts including multi-track jogs | Sean D. Burns, Lawrence A. Clevenger, Sivananda K. Kanakasabapathy, Yann Mignot, Christopher J. Penny +2 more | 2018-06-05 |
| 9972533 | Aligning conductive vias with trenches | Sean D. Burns, Lawrence A. Clevenger, Sivananda K. Kanakasabapathy, Yann Mignot, Christopher J. Penny +2 more | 2018-05-15 |
| 9934970 | Self aligned pattern formation post spacer etchback in tight pitch configurations | Sean D. Burns, Lawrence A. Clevenger, Nelson Felix, Sivananda K. Kanakasabapathy, Christopher J. Penny +2 more | 2018-04-03 |
| 9852946 | Self aligned conductive lines | Sean D. Burns, Lawrence A. Clevenger, Sivananda K. Kanakasabapathy, Yann Mignot, Christopher J. Penny +2 more | 2017-12-26 |
| 9842737 | Self-aligned quadruple patterning process | Sivananda K. Kanakasabapathy, Fee Li Lie, Stuart A. Sieg | 2017-12-12 |
| 9779944 | Method and structure for cut material selection | Sean D. Burns, Lawrence A. Clevenger, Nelson Felix, Sivananda K. Kanakasabapathy, Yann Mignot +3 more | 2017-10-03 |
| 9773700 | Aligning conductive vias with trenches | Sean D. Burns, Lawrence A. Clevenger, Sivananda K. Kanakasabapathy, Yann Mignot, Christopher J. Penny +2 more | 2017-09-26 |
| 9659824 | Graphoepitaxy directed self-assembly process for semiconductor fin formation | Joy Cheng, Michael A. Guillorn, Chi-Chun Liu, Melia Tjio, HsinYu Tsai | 2017-05-23 |
| 9607886 | Self aligned conductive lines with relaxed overlay | Sean D. Burns, Lawrence A. Clevenger, Sivananda K. Kanakasabapathy, Yann Mignot, Christopher J. Penny +2 more | 2017-03-28 |
| 9601345 | Fin trimming in a double sit process | Kangguo Cheng, Bruce B. Doris, Ali Khakifirooz | 2017-03-21 |
| 9563122 | Method to harden photoresist for directed self-assembly processes | Joy Cheng, Chi-Chun Liu | 2017-02-07 |
| 9378972 | Integration of dense and variable pitch fin structures | Kangguo Cheng, Bruce B. Doris, Ali Khakifirooz | 2016-06-28 |
| 9305845 | Self-aligned quadruple patterning process | Sivananda K. Kanakasabapathy, Fee Li Lie, Stuart A. Sieg | 2016-04-05 |
| 9123658 | Grapho-epitaxy DSA process with dimension control of template pattern | Jassem A. Abdallah, Steven J. Holmes, Chi-Chun Liu | 2015-09-01 |
| 9087792 | Integration of dense and variable pitch fin structures | Kangguo Cheng, Bruce B. Doris, Ali Khakifirooz | 2015-07-21 |
| 9058997 | Process of multiple exposures with spin castable films | Martin Burkhardt, Sean D. Burns | 2015-06-16 |
| 9040371 | Integration of dense and variable pitch fin structures | Kangguo Cheng, Bruce B. Doris, Ali Khakifirooz | 2015-05-26 |
| 8986596 | Methods of forming nanoparticles using semiconductor manufacturing infrastructure | Joy Cheng, Daniel J. Coady, Blake Davis, James L. Hedrick, Steven J. Holmes +2 more | 2015-03-24 |
| 8901741 | Interconnect structures with engineered dielectrics with nanocolumnar porosity | Satya V. Nitta, Sampath Purushothaman, Charles T. Black, Kathryn Guarini | 2014-12-02 |
| 8883649 | Sidewall image transfer process | Yunpeng Yin, John C. Arnold, Sean D. Burns | 2014-11-11 |
| 8859433 | DSA grapho-epitaxy process with etch stop material | Jassem A. Abdallah, Steven J. Holmes, Daiji Kawamura, Chi-Chun Liu, Muthumanickam Sankarapandian +1 more | 2014-10-14 |
| 8853085 | Grapho-epitaxy DSA process with dimension control of template pattern | Jassem A. Abdallah, Steven J. Holmes, Chi-Chun Liu | 2014-10-07 |