HS

Huiling Shang

IBM: 22 patents #4,909 of 70,183Top 7%
TSMC: 17 patents #1,893 of 12,232Top 20%
Globalfoundries: 2 patents #1,397 of 4,424Top 35%
📍 Xialubei, NY: #1 of 1 inventorsTop 100%
Overall (All Time): #75,264 of 4,157,543Top 2%
41
Patents All Time

Issued Patents All Time

Showing 26–41 of 41 patents

Patent #TitleCo-InventorsDate
8927361 High threshold voltage NMOS transistors for low power IC technology Roger A. Booth, Jr., Victor Chan, Narasimhulu Kanike, Varadarajan Vidya, Jun Yuan 2015-01-06
8685818 Method of forming a shallow trench isolation embedded polysilicon resistor Ying Li, Henry K. Utomo 2014-04-01
8592264 Source-drain extension formation in replacement metal gate transistor device Takashi Ando, Huiming Bu, Ramachandra Divakaruni, Bruce B. Doris, Chung-Hsun Lin +1 more 2013-11-26
8558313 Bulk substrate FET integrated on CMOS SOI Anthony I. Chou, Arvind Kumar, Shreesh Narasimha, Ning Su 2013-10-15
8232599 Bulk substrate FET integrated on CMOS SOI Anthony I. Chou, Arvind Kumar, Shreesh Narasimha, Ning Su 2012-07-31
8154130 Self-aligned metal to form contacts to Ge containing substrates and structure formed thereby Cyril Cabral, Jr., Roy A. Carruthers, Christophe Detavernier, Simon Gaudet, Christian Lavoie 2012-04-10
8080838 Contact scheme for FINFET structures with multiple FINs Leland Chang, Wilfried E. Haensch, Meikei Ieong, Ghavam G. Shahidi 2011-12-20
7790538 Integration of strained Ge into advanced CMOS technology Meikei Ieong, Jack O. Chu, Kathryn Guarini 2010-09-07
7682968 Self-aligned metal to form contacts to Ge containing substrates and structure formed thereby Cyril Cabral, Jr., Roy A. Carruthers, Christophe Detavernier, Simon Gaudet, Christian Lavoie 2010-03-23
7521376 Method of forming a semiconductor structure using a non-oxygen chalcogen passivation treatment Martin M. Frank, Steven J. Koester, John A. Ott 2009-04-21
7449782 Self-aligned metal to form contacts to Ge containing substrates and structure formed thereby Cyril Cabral, Jr., Roy A. Carruthers, Christophe Detavernier, Simon Gaudet, Christian Lavoie 2008-11-11
7387925 Integration of strained Ge into advanced CMOS technology Meikei Ieong, Jack O. Chu, Kathryn Guarini 2008-06-17
7244958 Integration of strained Ge into advanced CMOS technology Meikei Ieong, Jack O. Chu, Kathryn Guarini 2007-07-17
7078300 Thin germanium oxynitride gate dielectric for germanium-based devices Evgeni Gousev, Christopher P. D'Emic, Paul Kozlowski 2006-07-18
6803266 Process for passivating the semiconductor-dielectric interface of a MOS device and MOS device formed thereby Paul M. Solomon, Douglas A. Buchanan, Eduard A. Cartier, Kathryn Guarini, Fenton R. McFeely +1 more 2004-10-12
6603181 MOS device having a passivated semiconductor-dielectric interface Paul M. Solomon, Douglas A. Buchanan, Eduard A. Cartier, Kathryn Guarini, Fenton R. McFeely +1 more 2003-08-05