HK

Howard L. Kalter

IBM: 61 patents #1,284 of 70,183Top 2%
📍 Colchester, VT: #11 of 432 inventorsTop 3%
🗺 Vermont: #100 of 4,968 inventorsTop 3%
Overall (All Time): #37,105 of 4,157,543Top 1%
62
Patents All Time

Issued Patents All Time

Showing 26–50 of 62 patents

Patent #TitleCo-InventorsDate
5899703 Method for chip testing H. Bernhard Pogge, George S. Prokop, Donald L. Wheater 1999-05-04
5875470 Multi-port multiple-simultaneous-access DRAM chip Jeffrey H. Dreibelbis, Wayne F. Ellis, Thomas J. Heller, Jr., Michael Ignatowski, David Meltzer 1999-02-23
5866443 Very dense integrated circuit package and method for forming the same H. Bernhard Pogge, Johann Greschner, Raymond J. Rosner 1999-02-02
5814885 Very dense integrated circuit package H. Bernhard Pogge, Johann Greschner 1998-09-29
5796662 Integrated circuit chip with a wide I/O memory array and redundant data lines John E. Barth, Jr. 1998-08-18
5770884 Very dense integrated circuit package H. Bernhard Pogge, Johann Greschner, Raymond J. Rosner 1998-06-23
5702984 Integrated mulitchip memory module, structure and fabrication Claude L. Bertin, Wayne J. Howell, Erik L. Hedberg, Gordon A. Kelley, Jr. 1997-12-30
5691248 Methods for precise definition of integrated circuit chip edges John Cronin, Wayne J. Howell, Patricia E. Marmillion, Anthony M. Palagonia, Bernadette Ann Pierson +1 more 1997-11-25
5682394 Fault tolerant computer memory systems and components employing dual level error correction and detection with disablement feature Robert M. Blake, Douglas Craig Bossen, Chin-Long Chen, John A. Fifield 1997-10-28
5663924 Boundary independent bit decode for a SDRAM John E. Barth, Jr. 1997-09-02
5656544 Process for forming a polysilicon electrode in a trench Albert S. Bergendahl, Claude L. Bertin, John Cronin, Donald M. Kenney, Chung H. Lam +1 more 1997-08-12
5648684 Endcap chip with conductive, monolithic L-connect for multichip stack Claude L. Bertin, Wayne J. Howell 1997-07-15
5581567 Dual level error detection and correction employing data subsets from previously corrected data Chin-Long Chen, John A. Fifield, Willem B. van der Hoeven 1996-12-03
5571754 Method of fabrication of endcap chip with conductive, monolithic L-connect for multichip stack Claude L. Bertin, Wayne J. Howell 1996-11-05
5563086 Integrated memory cube, structure and fabrication Claude L. Bertin, Wayne J. Howell, Erik L. Hedberg, Gordon A. Kelley, Jr. 1996-10-08
5561622 Integrated memory cube structure Claude L. Bertin, Wayne J. Howell, Erik L. Hedberg, Gordon A. Kelley, Jr. 1996-10-01
5533036 Fault tolerant computer memory systems and components employing dual level error correction and detection with disablement feature Robert M. Blake, Douglas Craig Bossen, Chin-Long Chen, John A. Fifield 1996-07-02
5463335 Power up detection circuits Sridhar Divakaruni, Jeffrey H. Dreibelbis, Wayne F. Ellis, Anatol Furman 1995-10-31
5426566 Multichip integrated circuit packages and systems Kenneth E. Beilstein, Jr., Claude L. Bertin, Gordon A. Kelley, Jr., Christopher P. Miller, Dale E. Pontius +2 more 1995-06-20
5399516 Method of making shadow RAM cell having a shallow trench EEPROM Albert S. Bergendahl, Claude L. Bertin, John Cronin, Donald M. Kenney, Chung H. Lam +1 more 1995-03-21
5270261 Three dimensional multichip package methods of fabrication Claude L. Bertin, Paul A. Farrar, Gordon A. Kelley, Jr., Willem B. van der Hoeven, Francis R. White 1993-12-14
5241500 Method for setting test voltages in a flash write mode John E. Barth, Jr. 1993-08-31
5228046 Fault tolerant computer memory systems and components employing dual level error correction and detection with disablement feature Robert M. Blake, Douglas Craig Bossen, Chin-Long Chen, John A. Fifield 1993-07-13
5202754 Three-dimensional multichip packages and methods of fabrication Claude L. Bertin, Paul A. Farrar, Gordon A. Kelley, Jr., Willem B. van der Hoeven, Francis R. White 1993-04-13
5196722 Shadow ram cell having a shallow trench eeprom Albert S. Bergendahl, Claude L. Bertin, John Cronin, Donald M. Kenney, Chung H. Lam +1 more 1993-03-23